Cryogenic Quantum Bump Integration Engineer

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries U.S. Inc. in Essex Junction, VT is seeking a skilled R&D bump process engineer to join the Quantum Advanced Packaging team.

You will own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging. The role involves leading cryogenic bump tech development, defining process flows, optimizing structures, and coordinating with device/qubit, cryogenic system teams, packaging & assembly teams, modeling and reliability teams,

Qualifications

• Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program. MS degree with at least 8 years of prior related work experience.
• In depth knowledge of BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal). Travel - Up to 10%.

Responsibilities

• Lead development of cryogenic-compatible bump interconnect technologies (e.g., indium, SnAg, Cu pillar, superconducting metals).
• Define and optimize bump structures, metallurgy, and process flows for superconducting integration.
• Establish process windows to ensure electrical, thermal, and mechanical stability at mK-K temperatures (CTE mismatch, fatigue, diffusion).
• Own end-to-end bump integration flows from wafer-level processing through assembly and qualification.
• Develop and implement integration schemes across 2.5D/3D architectures (interposers, TSVs, die-to-wafer flows).

Skills

Problem solving

Troubleshooting

Design of Experiments

English proficiency

Education

Master’s degree in Electrical/Mechanical/Chemical/Materials Science or related field

PhD in related field (preferred)

Job description

GlobalFoundries U.S. Inc. in Essex Junction, VT is seeking a skilled R&D bump process engineer to join the Quantum Advanced Packaging team.

You will own development and integration of cryogenic, superconducting bumping processes enabling scalable quantum hardware packaging. The role involves leading cryogenic bump tech development, defining process flows, optimizing structures, and coordinating with device/qubit, cryogenic system teams, packaging & assembly teams, modeling and reliability teams,