Cryogenic TSV Integration Engineer – Quantum Packaging

GLOBALFOUNDRIES U.S. INC.; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries Fab8 is seeking a highly skilled R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.

You will lead TSV process development, define architectures, and drive end-to-end integration across fabrication and packaging stacks, advancing protoypes to manufacturable flows in a collaboration-heavy environment.

Qualifications

• Master’s in Electrical Engineering or related field from an accredited program.
• MS degree with at least 8 years of related work experience.
• English fluency (written & verbal).
• Travel up to 20%.

Responsibilities

• Lead development of TSV processes for cryogenic and superconducting applications.
• Define TSV architectures including superconducting liners and dielectric isolation schemes.
• Ensure TSV designs are optimized for low-loss signal transport and cryogenic stability.
• Own end-to-end TSV integration flows across etch, liner deposition, dielectric, and metallization.
• Drive process integration planning to enable prototyping and qualification across programs.
• Develop TSV solutions for superconducting interposers and 3D integration platforms.
• Support integration with bump/RDL, assembly, and bonding flows.
• Collaborate with device/test teams to meet cryogenic electrical performance requirements.

Skills

English (Written & Verbal)

Education

Master’s in Electrical Engineering

Job description

GlobalFoundries Fab8 is seeking a highly skilled R&D TSV engineer to own development and integration of cryogenic, superconducting TSV technologies enabling high-density vertical interconnects for scalable quantum packaging from concept through manufacturing.

You will lead TSV process development, define architectures, and drive end-to-end integration across fabrication and packaging stacks, advancing protoypes to manufacturable flows in a collaboration-heavy environment.