Quantum Packaging Engineer — Cryogenic Assembly & Scaling

GLOBALFOUNDRIES U.S. INC.; Essex Junction (VT); On-site; USD 118,000 - 210,000; Full time

Job summary

GlobalFoundries Fab9 is seeking a highly skilled R&D assembly engineer to join our Quantum Advanced Packaging team. You will own development and integration of cryogenic, superconducting assembly processes enabling scalable quantum hardware packaging.

Lead assembly schemes and flows from wafer to package, collaborate with cross-functional teams, and drive readiness for cutting-edge technologies in a demanding, global manufacturing environment.

Qualifications

• Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited program; MS with 10+ years experience.

Responsibilities

• Lead development of cryogenic-compatible assembly processes for 2D, 2.5D, and 3D quantum packaging platforms.
• Define assembly schemes for Flip-chip / micro-bump / superconducting bump attach; D2W, W2W, and hybrid bonding.
• Own assembly integration flows from incoming wafer/die through package build.
• Coordinate process interactions across bump/interconnect, TSV/interposer, substrate/package assembly.
• Enable prototype builds and ensure smooth execution through assembly lines.
• Drive assembly readiness for new technologies incl. tooling, materials, and process modules.
• Support hands-on build/debug during early phases.

Skills

Cryogenic assembly

Wafer/Die alignment

DOE (Design of Experiments)

Cross-functional collaboration

Troubleshooting

Education

Master's degree in EE/ME/ChemE/MSE or related

PhD preferred

Tools

Cryogenic bonding tools

Job description

GlobalFoundries Fab9 is seeking a highly skilled R&D assembly engineer to join our Quantum Advanced Packaging team. You will own development and integration of cryogenic, superconducting assembly processes enabling scalable quantum hardware packaging.

Lead assembly schemes and flows from wafer to package, collaborate with cross-functional teams, and drive readiness for cutting-edge technologies in a demanding, global manufacturing environment.