Process Integration Engineer – Wafer-Level & AI

Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 140,000; Full time

Job summary

Micron Technology, Inc. is seeking a Process Integration Engineer for the Advanced Packaging Technology Development (APTD) group. You will develop and integrate wafer-level processes for next‑gen memory, solving complex challenges with AI-augmented data analysis.

You will collaborate across departments to balance performance, manufacturability, and cost. The role emphasizes hands-on problem solving, experimental design, and cross-functional teamwork in a fast-paced environment at Micron’s Boise

Qualifications

• 5+ years semiconductor experience in process integration or related field
• Experience delivering technical results with experiment design and analysis
• Knowledge of DRAM/NAND memory technologies or emerging memory architectures

Responsibilities

• Lead technical integration projects for new memory and advanced packaging technologies
• Design and complete experiments to assess process performance, variability, reliability, and yield
• Apply AI tools to data analysis, experiment planning, documentation, and technical problem solving

Skills

Problem solving

Cross-functional collab

Statistical analysis

Design of Experiments

AI tooling

Education

BS in Engineering

MS in related field

PhD

Tools

DoE software

Statistical software

Job description

Micron Technology, Inc. is seeking a Process Integration Engineer for the Advanced Packaging Technology Development (APTD) group. You will develop and integrate wafer-level processes for next‑gen memory, solving complex challenges with AI-augmented data analysis.

You will collaborate across departments to balance performance, manufacturability, and cost. The role emphasizes hands-on problem solving, experimental design, and cross-functional teamwork in a fast-paced environment at Micron’s Boise