Process Integration Engineer, APTD

Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 140,000; Full time

Job summary

Micron Technology, Inc. is seeking a Process Integration Engineer for the Advanced Packaging Technology Development (APTD) group. You will develop and integrate wafer-level processes for next‑gen memory, solving complex challenges with AI-augmented data analysis.

You will collaborate across departments to balance performance, manufacturability, and cost. The role emphasizes hands-on problem solving, experimental design, and cross-functional teamwork in a fast-paced environment at Micron’s Boise

Qualifications

• 5+ years semiconductor experience in process integration or related field
• Experience delivering technical results with experiment design and analysis
• Knowledge of DRAM/NAND memory technologies or emerging memory architectures

Responsibilities

• Lead technical integration projects for new memory and advanced packaging technologies
• Design and complete experiments to assess process performance, variability, reliability, and yield
• Apply AI tools to data analysis, experiment planning, documentation, and technical problem solving

Skills

Problem solving

Cross-functional collab

Statistical analysis

Design of Experiments

AI tooling

Education

BS in Engineering

MS in related field

PhD

Tools

DoE software

Statistical software

Job description

Req ID: JR110875 Process Integration Engineer, APTD

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

The Advanced Packaging Technology Development (APTD) organization develops next-generation packaging and integration technologies for future memory products. We bring together engineers and scientists to overcome complicated integration, performance, and manufacturability challenges. Working across technology development, device engineering, package design, product engineering, reliability, and manufacturing, we turn new concepts into manufacturable solutions for High Bandwidth Memory (HBM) and other advanced memory products.

Position Overview:

As a Process Integration Engineer within APTD, you will develop and integrate semiconductor process flows for next-generation memory and packaging technologies, with a focus on Wafer-Level Technology (WLT) and reconstructed substrates returning to wafer-form fab processing. You will lead technical projects, solve exciting integration problems, and work across engineering fields to balance performance, manufacturability, quality, reliability, cost, and schedule. This role is well suited for an engineer who enjoys hands‑on problem solving, collaborative R&D, and using emerging tools such as AI to improve engineering workflows and decision‑making.

Responsibilities:

• Lead technical integration projects for new memory and advanced packaging technologies
• Design and complete experiments to assess process performance, variability, reliability, and yield
• Solve complex integration issues using data from inline, defect, parametric, probe, reliability, and package‑level testing
• Partner across Process Integration, Process Development, Device Engineering, Package Design, Product Engineering, Reliability, Materials, and Manufacturing to develop and qualify new technologies
• Apply AI tools to data analysis, experiment planning, documentation, and technical problem‑solving

Minimum Qualifications:

• BS in Electrical/Chemical/Mechanical Engineering, Materials Science & Engineering, Physics, or a related technical field with 5+ years semiconductor experience; MS in a related field with 4+ years of semiconductor experience; or PhD and 2+ years of semiconductor experience.
• Experience delivering technical results in process integration, process development, or device development, including experiment design, execution, and analysis
• Knowledge of semiconductor process integration and memory technologies such as DRAM, NAND, and/or emerging memory architectures
• Experience solving technical problems using data‑driven methods such as statistical analysis, Design of Experiments (DoE), and root‑cause analysis
• Experience leading technical projects, collaborating across functions, communicating complex technical information, and using AI tools to improve technical workflows

Preferred Qualifications:

• Experience with advanced packaging technologies such as wafer‑level packaging, fan‑out packaging, 2.5D/3D integration, TSV, microbump, hybrid bonding, or chiplet integration
• Experience with Wafer‑Level Technology or reconstituted wafer flows, including die shift, warpage, thickness/TTV, edge integrity, defectivity, or handling
• Experience developing, qualifying, and transferring semiconductor processes or integration solutions to high‑volume manufacturing, including multi‑site development
• Experience with device or package reliability and test methodologies, including probe, final test, burn‑in, stress testing, or reliability qualification
• Experience applying AI or machine‑learning tools to engineering data analysis, anomaly detection, yield improvement, or other engineering workflows

Job Profile(s):

Semiconductor Process Engineer 3 - Semiconductor Process Engineer 5

Relocation Level: TBD

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.