Memory Process Integration Engineer with AI Tools

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 170,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off and holidays

Retirement and benefits guide

Job summary

Micron Technology, Inc. is seeking a Process Integration Engineer within the Advanced Packaging Technology Development organization to advance wafer-level and reconstructed wafer flows for next‑generation memory products.

You will lead cross‑functional projects, design experiments, and apply AI-driven methods to improve processes and yield. The role emphasizes hands-on problem solving across engineering disciplines, data‑driven decisions, and collaboration to balance performance,

Qualifications

• BS in Electrical/Chemical/Mechanical Engineering or related field with 5+ years semiconductor experience
• MS with 4+ years semiconductor experience
• PhD with 2+ years semiconductor experience
• Experience delivering technical results in process integration, development or device development
• Knowledge of memory technologies and data-driven problem solving

Responsibilities

• Lead technical integration projects for new memory and advanced packaging technologies
• Design and complete experiments to assess process performance, variability, reliability, and yield
• Solve complex integration issues using data from inline, defect, parametric, probe, reliability, and package-level testing
• Partner across Process Integration, Process Development, Device Engineering, Package Design, Product Engineering, Reliability, Materials, and Manufacturing
• Apply AI tools to data analysis, experiment planning, documentation, and technical problem-solving

Skills

Data-driven problem solving

Statistical analysis

Design of Experiments

AI/ML in engineering

Cross-functional collaboration

Education

BS in Engineering

MS in Engineering

PhD (optional)

Job description

Micron Technology, Inc. is seeking a Process Integration Engineer within the Advanced Packaging Technology Development organization to advance wafer-level and reconstructed wafer flows for next‑generation memory products.

You will lead cross‑functional projects, design experiments, and apply AI-driven methods to improve processes and yield. The role emphasizes hands-on problem solving across engineering disciplines, data‑driven decisions, and collaboration to balance performance,