Staff Process Engineer - APTD Bonding & Advanced Packaging

Micron Technology, Inc

Boise (ID)

On-site

USD 80,000 - 110,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical, dental, and vision plans
Paid family leave
Paid time-off program
Paid holidays

Job summary

Micron Technology, Inc in Boise, Idaho is looking for a Staff Process Engineer. In this role, you will improve product quality and reliability by developing and optimizing processes, resolving manufacturing line problems, and implementing changes effectively.

The ideal candidate has a BS in a relevant STEM field and at least 5 years of industry experience. Micron offers a comprehensive benefits package including healthcare, paid time-off, and support for professional growth.

Qualifications

  • 5 years of relevant industry experience required.
  • Experience in semiconductor process engineering and packaging.
  • Ability to resolve sophisticated issues through root-cause analysis.

Responsibilities

  • Develop new or modified process formulations and define equipment requirements.
  • Coordinate and complete process, equipment, and material evaluation.
  • Audit material suppliers to achieve quality and cost management objectives.

Skills

Advanced Package Integration knowledge
Design of experiment techniques (DOE)
Statistical Process Control (SPC)
Defect analysis
Data analysis

Education

BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics
MS or PhD in relevant fields (preferred)

Job description

Micron Technology, Inc in Boise, Idaho is looking for a Staff Process Engineer. In this role, you will improve product quality and reliability by developing and optimizing processes, resolving manufacturing line problems, and implementing changes effectively.

The ideal candidate has a BS in a relevant STEM field and at least 5 years of industry experience. Micron offers a comprehensive benefits package including healthcare, paid time-off, and support for professional growth.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Staff Process Engineer, APTD Bonding — Yield & Quality
Staff Process Engineer, APTD Bonding — Yield & Quality

Micron Technology, Inc. • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental and vision plans
Paid family leave
Paid time off
+1
Bonding Process Engineer, APTD — Innovate Packaging
Bonding Process Engineer, APTD — Innovate Packaging

Micron Technology • Boise (ID)

On-site
USD 90,000 - 110,000
Comprehensive medical, dental, and vision plans
Robust paid time-off program
Paid family leave
Process Engineer, APTD Bonding — Yield & Reliability
Process Engineer, APTD Bonding — Yield & Reliability

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Advanced Packaging Process Technician
Advanced Packaging Process Technician

Micron Technology, Inc • Boise (ID)

On-site
USD 40,000 - 60,000
Medical, dental, and vision plans
Paid time-off programs
Paid family leave
Staff Process Engineer, Advanced Packaging & CMP
Staff Process Engineer, Advanced Packaging & CMP

Micron Technology, Inc • Boise (ID)

On-site
USD 120,000 - 180,000
Medical, dental & vision plans
Paid time off
Paid holidays
+1
Staff Engineer: Advanced Packaging Photolithography
Staff Engineer: Advanced Packaging Photolithography

Micron Technology • Boise (ID)

On-site
USD 85,000 - 115,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Advanced Packaging Process Technician: Drive Innovation
Advanced Packaging Process Technician: Drive Innovation

Micron Memory Malaysia Sdn Bhd • Boise (ID)

On-site
USD 55,000 - 75,000
Staff Process Engineer, APTD Bonding
Staff Process Engineer, APTD Bonding

Micron Technology, Inc • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Paid time-off program
+1
Wafer Bonding Process Engineer: Advanced Development
Wafer Bonding Process Engineer: Advanced Development

Micron Technology, Inc • Boise (ID)

On-site
USD 75,000 - 95,000
Medical, dental and vision plans
Paid family leave
Paid time-off program
+1
Staff Process Engineer: Advanced Packaging Lithography
Staff Process Engineer: Advanced Packaging Lithography

Micron Technology, Inc • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Income protection benefits
Paid family leave
+1