Process Engineer, Advanced Packaging & Automation

Micron; Boise (ID); On-site; USD 110,000 - 140,000; Full time

Job summary

Micron Technology in Boise, Idaho is seeking a Process Engineer who will improve quality, reliability, and manufacturability of future memory products. This role combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment.

You will drive technical advancements, influence technology roadmaps, and contribute to next-generation semiconductor solutions.

Qualifications

• BS in a technical field with 3+ years of experience; MS or PhD also acceptable.
• Experience in semiconductor process engineering, packaging, or advanced package integration.
• Knowledge of DRAM, NAND, or other memory technologies.
• Experience with DOE, SPC, defect analysis, and data analysis.
• Ability to solve complex technical problems and drive projects.

Responsibilities

• Optimize automation, equipment, and process performance to improve product quality, reliability, and cost.
• Develop and enhance host, automation, and data systems to accelerate learning and decision‑making.
• Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC.
• Partner with equipment, process development, and process integration teams to develop and implement new solutions.
• Support pilot line operations and technology transfer to high-volume manufacturing sites.

Skills

Semiconductor process engineering

DOE

SPC

Root cause analysis

Cross-functional collaboration

Education

BS in Materials Science or related field

MS in related field (1+ year)

PhD in related technical field

Tools

Automation systems

Data systems

Job description

Micron Technology in Boise, Idaho is seeking a Process Engineer who will improve quality, reliability, and manufacturability of future memory products. This role combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment.

You will drive technical advancements, influence technology roadmaps, and contribute to next-generation semiconductor solutions.