Principal Thermal Architect — AI Compute & Packaging

QUALCOMM, Inc.

San Diego (CA)

Presencial

USD 160 000 - 240 000

Tempo integral

Há 11 dias

Uma candidatura completa num minuto

Currículo e carta de apresentação personalizados, prontos a enviar.

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Resumo da oferta

Qualcomm Technologies, Inc. is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable leading performance for the Dragonfly AI300 platform and future AI computing platforms.

You will work on cutting-edge thermal architecture, simulation, validation, and optimization with cross-functional teams across silicon, packaging, hardware, and system engineering. You will lead thermal design reviews, perform CFD analyses, and communicate results to stakeholders, driving

Qualificações

  • Bachelor’s degree in engineering with 4+ years of related experience.
  • Master’s degree with 3+ years of related experience.
  • PhD with 2+ years of related experience.

Responsabilidades

  • Lead thermal architecture solutions through simulation and test.
  • Perform CFD simulations across product development stages.
  • Drive strategy discussions and cross-functional tradeoffs.
  • Conduct thermal tests and present results to stakeholders.
  • Analyze results and document findings.

Conhecimentos

Thermal simulations
CFD analysis
Python
C/C++
MATLAB
Data analysis

Formação académica

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering
Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering
PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering

Ferramentas

ANSYS Icepak
Flotherm
Celsius EC

Descrição da oferta de emprego

Qualcomm Technologies, Inc. is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable leading performance for the Dragonfly AI300 platform and future AI computing platforms.

You will work on cutting-edge thermal architecture, simulation, validation, and optimization with cross-functional teams across silicon, packaging, hardware, and system engineering. You will lead thermal design reviews, perform CFD analyses, and communicate results to stakeholders, driving

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