Lead Thermal Architect, Server Packaging

QUALCOMM, Inc.; San Diego, Northern (CA, KY); Híbrido; USD 192.000 - 288.000; Jornada completa

Descripción de la vacante

Qualcomm Technologies, Inc. seeks a Sr Staff or Principal Thermal Engineer to lead advanced thermal solutions for server packaging in San Diego. You will drive CFD studies, automate modeling tools, and oversee tests from die to ambient while coordinating with cross-functional teams.

The role requires 10+ years in electronics cooling for servers, with expertise in TIMs, heat sinks, vapor chambers, and 2.5/3D packaging. Strong communication and presentation skills are essential.

Formación

• MS in Mechanical Engineering required; PhD preferred.
• 10+ years in electronics cooling for server products.
• Strong background in thermal management components.

Responsabilidades

• Lead thermal architecture through simulation and test with multiple stakeholders.
• Perform CFD simulations from die to ambient during development.
• Drive strategy discussions and cost/benefit tradeoffs.
• Develop scripts to automate thermal modeling and testing.
• Execute thermal tests and present validated results.

Conocimientos

Communication skills

Team collaboration

Problem solving

Educación

Master's in Mechanical Engineering

PhD in Mechanical Engineering (preferred)

Herramientas

ANSYS-Icepak

Celsius EC

Python

C/C++

MATLAB

SolidWorks

Creo

Descripción del empleo

Qualcomm Technologies, Inc. seeks a Sr Staff or Principal Thermal Engineer to lead advanced thermal solutions for server packaging in San Diego. You will drive CFD studies, automate modeling tools, and oversee tests from die to ambient while coordinating with cross-functional teams.

The role requires 10+ years in electronics cooling for servers, with expertise in TIMs, heat sinks, vapor chambers, and 2.5/3D packaging. Strong communication and presentation skills are essential.