Senior Thermal Architect for AI Compute & Packaging

Qualcomm; San Diego (CA); On-site; USD 160,000 - 240,000; Full time

Job summary

Qualcomm Technologies, Inc. in San Diego is seeking a Principal Thermal Engineer to solve complex thermal challenges across the Dragonfly AI300 platform.

You will lead thermal architecture, CFD simulations, and cross-functional collaboration to optimize performance, efficiency, and reliability from concept to production. The role requires advanced degrees with 2+ years minimum experience in system/package design or related work, and hands-on skills in thermal testing and model validation.

Qualifications

• Bachelor's degree in engineering with 4+ years in system/package design or related work.
• Master's degree with 3+ years' experience in system/package design or related work.
• PhD with 2+ years' experience in system/package design or related work.
• Experience in electronics cooling for high-performance computing or data center products.

Responsibilities

• Lead thermal architecture solutions through simulation and test with stakeholders.
• Perform CFD/thermal simulations from silicon to data center environments.
• Drive direction, tradeoffs, and present design reviews.
• Conduct thermal tests to validate models and present results.
• Analyze and document simulation and test results.

Skills

Thermal design

CFD analysis

Cross-functional collaboration

Technical presentations

Data analysis

Education

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field

Tools

ANSYS Icepak

Celsius EC

Flotherm

Python

MATLAB

C/C++

Job description

Qualcomm Technologies, Inc. in San Diego is seeking a Principal Thermal Engineer to solve complex thermal challenges across the Dragonfly AI300 platform.

You will lead thermal architecture, CFD simulations, and cross-functional collaboration to optimize performance, efficiency, and reliability from concept to production. The role requires advanced degrees with 2+ years minimum experience in system/package design or related work, and hands-on skills in thermal testing and model validation.