AI-Powered Power & Thermal Engineer

Qualcomm

San Diego (CA)

Presencial

USD 94.200 - 141.200

Jornada completa

14 días+

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Descripción de la vacante

Qualcomm Technologies, Inc. is seeking a Power/Thermal Software engineer to profile power and thermal use cases, identify risks, and deliver optimized mitigations across compute, mobile, IoT, automotive and AR/VR chipsets.

You will collaborate with Architecture, HW design, and software teams to implement end-to-end power/thermal software solutions and develop automation using AI infrastructures for large telemetry datasets.

Formación

  • Bachelor's degree in engineering or related field.
  • Systems/HW background with SoC awareness.
  • AI model development and data pipeline experience.
  • OS concepts: scheduling/memory management.
  • Experience with debug tools: JTAG, oscilloscopes, logic analyzers.
  • Knowledge of power/thermal management in mobile systems.
  • Embedded systems/SoC Power and Modem knowledge.

Responsabilidades

  • Profile power/thermal and identify risks; craft mitigations.
  • Perform system-level analysis of power/thermal use cases with cross‑functional teams.
  • Collaborate with Architecture, HW design, perf, and software teams for optimal solutions.
  • Develop automation using AI infrastructure to process telemetry data.
  • Build competitive analyses to tailor industry-leading thermal mitigations.

Conocimientos

Power/thermal software
AI infrastructure
Embedded systems
OS concepts
JTAG debugging
System‑level analysis

Educación

Bachelor's degree in Engineering/CS/IS

Herramientas

JTAG debugger
Oscilloscopes
Logic analyzers

Descripción del empleo

Qualcomm Technologies, Inc. is seeking a Power/Thermal Software engineer to profile power and thermal use cases, identify risks, and deliver optimized mitigations across compute, mobile, IoT, automotive and AR/VR chipsets.

You will collaborate with Architecture, HW design, and software teams to implement end-to-end power/thermal software solutions and develop automation using AI infrastructures for large telemetry datasets.

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