Senior Thermal Architect for AI Compute Hardware

Qualcomm Incorporated

San Diego (CA)

On-site

USD 160,000 - 240,000

Full time

12 days ago

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Benefits offered by this job

Annual discretionary bonus program
RSU grants
Comprehensive benefits package

Job summary

Qualcomm Technologies, Inc. seeks a Principal Thermal Engineer in San Diego to tackle advanced thermal challenges for Dragonfly AI300 and future AI platforms.

You will lead thermal architecture, simulate and validate designs, and collaborate across silicon, packaging, hardware, and system teams to ensure performance, efficiency, and reliability across products. The role requires 6+ years in electronics cooling with experience in high‑power processors, GPUs, or AI accelerators; proficiency in CFD

Qualifications

  • Bachelor's degree and 4+ years of relevant work experience in system/package design or technology engineering.
  • Master's degree and 3+ years of related experience; PhD with 2+ years accepted.
  • Proven background in electronics cooling for high‑power computing or data center products.

Responsibilities

  • Lead thermal architecture solutions via simulation and testing with stakeholders.
  • Perform CFD/thermal simulations from silicon to data center environment.
  • Drive direction, tradeoffs, and conduct design reviews with leaders.
  • Conduct thermal tests to validate models and present results.
  • Analyze and document simulation and test outcomes for decision making.

Education

Bachelor's degree in Chemical/Electrical/Mechanical Engineering
Master's degree in Chemical/Electrical/Mechanical Engineering
PhD in Chemical/Electrical/Mechanical Engineering

Tools

ANSYS Icepak
Celsius EC
Flotherm

Job description

Qualcomm Technologies, Inc. seeks a Principal Thermal Engineer in San Diego to tackle advanced thermal challenges for Dragonfly AI300 and future AI platforms.

You will lead thermal architecture, simulate and validate designs, and collaborate across silicon, packaging, hardware, and system teams to ensure performance, efficiency, and reliability across products. The role requires 6+ years in electronics cooling with experience in high‑power processors, GPUs, or AI accelerators; proficiency in CFD

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