Lead Architect, AI Silicon Thermal & Packaging

ZutaCore; San Francisco (CA); On-site; USD 210,000 - 320,000; Full time

Job summary

ZutaCore seeks a Distinguished Engineer for AI Silicon Thermal Architecture to define the long-term thermal vision for AI silicon and packaging. You will influence cooling integration across GPU, AI accelerators, and advanced packaging roadmaps while shaping product and partnership decisions.

You will work with Product, Engineering, Business Development, and silicon partners to translate trends into strategic roadmaps and external leadership engagements.

Qualifications

• 10+ years of experience in semiconductor architecture or AI systems.
• Deep knowledge of advanced packaging and heterogeneous integration.
• Deep understanding of GPU/AI accelerator architectures.
• Experience defining multi-year technology strategies or roadmaps.
• Ability to bridge semiconductor architecture, thermal engineering, product strategy, and business priorities.
• Excellent communication skills with executive and technical audiences.

Responsibilities

• Own ZutaCore's long-term AI silicon thermal integration roadmap and help drive near-term milestones.
• Evaluate emerging AI architectures, advanced-packaging technologies, and power-delivery trends.
• Develop strategies for integrating cooling into the package across lid/IHS, interposer, and substrate.
• Partner with engineering teams to translate technology vision into executable roadmaps.
• Collaborate and co-design with leading semiconductor companies, foundries, OSATs, hyperscalers, and partners.
• Represent ZutaCore externally through customer engagements, conferences, standards bodies, and industry leadership.

Skills

Semiconductor architecture

AI systems expertise

Advanced packaging

Heterogeneous integration

Thermal engineering

Strategic roadmaps

Job description

ZutaCore seeks a Distinguished Engineer for AI Silicon Thermal Architecture to define the long-term thermal vision for AI silicon and packaging. You will influence cooling integration across GPU, AI accelerators, and advanced packaging roadmaps while shaping product and partnership decisions.

You will work with Product, Engineering, Business Development, and silicon partners to translate trends into strategic roadmaps and external leadership engagements.