Principal Laser Packaging Engineer for High-Power PCSELs

Liminal; San Francisco (CA); On-site; USD 135,000 - 165,000; Full time

Benefits offered by this job

Equity stake in TopoLight

Job summary

TopoLight is seeking a Principal Engineer to own the packaging of a high-power laser module. You will shepherd a laser die from concept to a manufacturable, taped-out package, owning the thermal path, die-attach strategy, and integration to meet wavelength, efficiency, and reliability targets.

Responsibilities include designing the thermal path, translating performance targets into a manufacturable package, and modeling thermal/mechanical behavior while driving assembly and characterization in a

Qualifications

• Hands-on laser or optoelectronic packaging experience required.
• Experience packaging high-power CW semiconductor lasers.
• Ability to take a laser die from concept to taped-out package.
• Solid understanding of thermal impacts on laser behavior.
• Startup-friendly with tolerance for ambiguity and rapid iteration.

Responsibilities

• Own the laser package architecture from concept through tape-out.
• Design the thermal path from die-attach to submount, heat-spreader and cooler.
• Translate device performance targets into a manufacturable package maintaining wavelength and efficiency.
• Model thermal and mechanical behavior and correlate with measured metrics.
• Debug and iterate problems quickly in a fast-moving environment.

Skills

Packaging experience

High-power CW laser packaging

Thermal analysis

Cross-functional communication

Education

B.S./M.S. in EE/Materials/Physics/Mechanical or Optical Eng

Job description

TopoLight is seeking a Principal Engineer to own the packaging of a high-power laser module. You will shepherd a laser die from concept to a manufacturable, taped-out package, owning the thermal path, die-attach strategy, and integration to meet wavelength, efficiency, and reliability targets.

Responsibilities include designing the thermal path, translating performance targets into a manufacturable package, and modeling thermal/mechanical behavior while driving assembly and characterization in a