Senior Optoelectronic Packaging Engineer

Molex; Bridgewater (MA); On-site; USD 150,000 - 260,000; Full time

Job summary

Molex is seeking a Principal Mechanical Engineer to own mechanical designs of advanced optoelectronic packages in the United States. The role collaborates with R&D, product design, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.

You will lead the design of laser diode packages, optimize optical subassemblies for high coupling efficiency, and develop hermetic and thermally managed architectures for

Qualifications

• Masters in Mechanical Engineering required with strong background in optoelectronic packaging.
• Demonstrated experience with optical alignment of components to submicron tolerances.
• Experience with NPI methodology: design, verification, qualification, release to manufacturing.

Responsibilities

• Lead mechanical design and layout of laser diode packages and subcomponents.
• Design and optimize optical subassemblies to achieve submicron alignment and high coupling efficiency.
• Develop package architectures with thermal electric coolers, hermetic housings, and fiber attach features.
• Ensure compatibility with active alignment processes and drift control during solder reflow or epoxy cure.
• Perform thermal and mechanical analyses (FEA) and evaluate impact on wavelength and reliability.
• Drive design-for-manufacturability (DFM) for high-yield, scalable production.

Skills

Submicron alignment

FEA modelling

Thermal management

DFM

Supplier collaboration

Education

Master's in Mechanical Engineering

Tools

FEA software

CAD software

Job description

Molex is seeking a Principal Mechanical Engineer to own mechanical designs of advanced optoelectronic packages in the United States. The role collaborates with R&D, product design, manufacturing, suppliers, and customers to ensure laser components meet stringent optical, mechanical, and Telcordia reliability requirements.

You will lead the design of laser diode packages, optimize optical subassemblies for high coupling efficiency, and develop hermetic and thermally managed architectures for