Senior Principal Optical Packaging Engineer

Coherent Corp.; Saxonburg (PA); On-site; USD 120,000 - 180,000; Full time

Job summary

Coherent Corp. in Saxonburg, PA, seeks an experienced engineer to drive Co-Packaged Optics and Optical Engine packaging from concept to production.

You will develop PIC and EIC co-design workflows, IO pad frames, and 3D interposer floor plans, and lead interconnect schematic and layout activities. Ideal candidates hold an MS or PhD in engineering or a sciences field with 5+ years in silicon photonics and laser design.

Qualifications

• MS/PhD in engineering or science, plus 5+ years of relevant experience.
• Experience with semiconductor laser design and silicon photonics.
• Experience with CPO, optical transceivers or components desirable.
• Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes
• Experience managing cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities.

Responsibilities

• Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production.
• Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan.
• Lead PIC and EIC interconnect schematic and monitor layout design process.
• Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.
• Lead optical package development to establish package manufacturability and reliability.
• Collaborate with cross-functional teams consisting of laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams.

Skills

Semiconductor laser design

Silicon photonics

High-speed modulation (MZM/MRM/EAM)

NPI

Cross-functional leadership

Packaging design

3D interposer floor plan

Education

MS/PhD in engineering or science

Job description

Coherent Corp. in Saxonburg, PA, seeks an experienced engineer to drive Co-Packaged Optics and Optical Engine packaging from concept to production.

You will develop PIC and EIC co-design workflows, IO pad frames, and 3D interposer floor plans, and lead interconnect schematic and layout activities. Ideal candidates hold an MS or PhD in engineering or a sciences field with 5+ years in silicon photonics and laser design.