Lead Thermo-Mechanical Engineer, Photonics Packaging

Lightmatter, Inc.; Mountain View (CA); Hybrid; USD 169,000 - 244,000; Full time

Benefits offered by this job

Equity grants

Hybrid workplace

Retirement savings matching

Life Insurance

Paid time off

Disability coverage

Training & development

Job summary

Lightmatter, Inc. is seeking a thermo-mechanical packaging engineer to lead finite element simulations for advanced photonics packaging.

You will champion model fidelity, develop wafer- and unit-level stress and warpage analyses, and collaborate with design, process, and materials teams to meet power, thermal, optical, and reliability targets. We value Python and MATLAB automation, strong writing skills, and the ability to communicate complex results to diverse stakeholders.

Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, or related field.
• Deep expertise in finite element analysis using commercial tools such as Ansys, Abaqus, or equivalent.
• Hands-on experience with multi-physics simulation including thermal-structural coupling, solder joint fatigue modeling, and warpage analysis.
• Strong understanding of semiconductor packaging failure modes including solder fatigue, delamination, CTE mismatch-driven stress, and underfill cracking under thermal cycling conditions.
• Experience with wafer-level and unit-level assembly processes including flip-chip, BGA, and advanced 3D packaging architectures.
• Proficiency in Python and/or MATLAB for simulation automation, data analysis, and scripting.
• Demonstrated ability to develop analytical or semi-empirical models for first-order engineering assessments.
• Experience driving characterization and validation programs through internal prototyping and external vendor collaboration.

Responsibilities

• Serve as the technical authority for thermo-mechanical simulation within the packaging organization.
• Identify capability gaps in simulation tooling, characterization methods, or material databases and champion investigations.
• Develop finite element stress, warpage, and assembly models for wafer-level and unit-level photonic packaging.
• Perform analysis to identify reliability risks and drive design solutions to improve mechanical integrity.
• Conduct multi-physics simulations including solder collapse modeling and thermal-structural analysis for packaging stress.
• Develop analytical or semi-empirical models for quick assessments of new concepts.
• Drive characterization and validation through prototyping and vendor collaboration.
• Develop Python and MATLAB automation frameworks to scale simulation throughput.
• Summarize findings and communicate recommendations to stakeholders across Lightmatter and customers.
• Write reports and document methodologies for the packaging team.

Skills

Finite element analysis

Multi-physics simulation

Python

MATLAB

Documentation

Engineering communication

Education

MS or PhD in Mechanical Engineering or Materials Science

Tools

Ansys

Abaqus

Job description

Lightmatter, Inc. is seeking a thermo-mechanical packaging engineer to lead finite element simulations for advanced photonics packaging.

You will champion model fidelity, develop wafer- and unit-level stress and warpage analyses, and collaborate with design, process, and materials teams to meet power, thermal, optical, and reliability targets. We value Python and MATLAB automation, strong writing skills, and the ability to communicate complex results to diverse stakeholders.