Principal Laser Packaging Engineer (Semiconductor Venture)

Liminal; San Francisco (CA); On-site; USD 135,000 - 165,000; Full time

Benefits offered by this job

Equity stake in TopoLight

Job summary

TopoLight is seeking a Principal Engineer to own the packaging of a high-power laser module. You will shepherd a laser die from concept to a manufacturable, taped-out package, owning the thermal path, die-attach strategy, and integration to meet wavelength, efficiency, and reliability targets.

Responsibilities include designing the thermal path, translating performance targets into a manufacturable package, and modeling thermal/mechanical behavior while driving assembly and characterization in a

Qualifications

• Hands-on laser or optoelectronic packaging experience required.
• Experience packaging high-power CW semiconductor lasers.
• Ability to take a laser die from concept to taped-out package.
• Solid understanding of thermal impacts on laser behavior.
• Startup-friendly with tolerance for ambiguity and rapid iteration.

Responsibilities

• Own the laser package architecture from concept through tape-out.
• Design the thermal path from die-attach to submount, heat-spreader and cooler.
• Translate device performance targets into a manufacturable package maintaining wavelength and efficiency.
• Model thermal and mechanical behavior and correlate with measured metrics.
• Debug and iterate problems quickly in a fast-moving environment.

Skills

Packaging experience

High-power CW laser packaging

Thermal analysis

Cross-functional communication

Education

B.S./M.S. in EE/Materials/Physics/Mechanical or Optical Eng

Job description

TopoLight is a venture-backed deep tech startup commercializing novel high-power photonic crystal lasers (PCSELs).

We're looking for a principal engineer who will own the packaging of our laser module. You'll take a high-power laser die from concept to a manufacturable, taped- out package. You'll own the thermal path, the die-attach and bonding strategy, and the integration that determines whether the device meets its wavelength, efficiency, and reliability targets, and drive it through assembly and characterization to make it real.

Note: This job posting was placed by Liminal, we're the venture builder that is backing TopoLight.

Responsibilities

• Own the laser package architecture from concept through tape-out
• Design the thermal path, from die-attach to the submount, heat-spreader and cooler
• Translate device performance targets into a manufacturable package that holds emission wavelength and efficiency across the range of operation
• Model the thermal and mechanical behavior of the device and correlate against measured junction temperature, wavelength, and rollover
• Debug and iterate problems quickly in a fast-moving environment

Qualifications

• B.S. or M.S. in EE, Materials Science, Physics, Mechanical or Optical Engineering, or equivalent, with hands-on laser or optoelectronic packaging experience
• Demonstrated experience packaging high-power CW semiconductor lasers
• Has taken at a laser die from concept to a taped-out, working package
• Solid understanding of how thermals impact and drive laser behavior
• Comfortable owning ambiguous problems in a startup environment
• Strong written and verbal communication, with a collaborative working style

Compensation

As a principal engineer, you will receive a significant stake of equity in TopoLight. Salary will

range from $135k - $165k based on experience, with a large stock allotment.