Lead Laser Packaging Engineer – High-Power PCSELs (Hybrid)

Zoho

San Francisco (CA)

Ibrido

USD 135.000 - 165.000

Tempo pieno

5 giorni fa
Candidati tra i primi
Generatore di candidature

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Descrizione del lavoro

Colwyn Group is actively seeking a Principal Laser Packaging Engineer in the San Francisco Bay Area, CA. The role centers on owning the laser package architecture for high-power PCSELs, guiding dies from concept to manufacturable, taped-out packages.

Responsibilities include thermal path design, die-attach strategy, and hardware integration to meet stringent performance specs. Requires experience in optoelectronic packaging and strong thermo-mechanical understanding for reliable device lifetime.

Competenze

  • Experience packaging high-power CW semiconductor lasers.
  • Strong understanding of thermo-mechanical dynamics on device lifetime.
  • Ability to translate electro-optical targets into manufacturable package designs.

Mansioni

  • Lead the complete laser package architecture from concept to tape-out.
  • Design and optimize thermal path including die-attach, submounts, heat spreaders, cooling integration.
  • Perform thermal and mechanical modeling and correlate with empirical data.
  • Troubleshoot, debug, and iterate packaging solutions in a startup environment.
  • Ensure wavelength stability and optical efficiency across operating conditions.

Conoscenze

Optoelectronic packaging
Laser packaging
Thermal modeling

Formazione

Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, Optical Engineering

Descrizione del lavoro

Colwyn Group is actively seeking a Principal Laser Packaging Engineer in the San Francisco Bay Area, CA. The role centers on owning the laser package architecture for high-power PCSELs, guiding dies from concept to manufacturable, taped-out packages.

Responsibilities include thermal path design, die-attach strategy, and hardware integration to meet stringent performance specs. Requires experience in optoelectronic packaging and strong thermo-mechanical understanding for reliable device lifetime.

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