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Colwyn Group is actively seeking a Principal Laser Packaging Engineer in the San Francisco Bay Area, CA. The role centers on owning the laser package architecture for high-power PCSELs, guiding dies from concept to manufacturable, taped-out packages.
Responsibilities include thermal path design, die-attach strategy, and hardware integration to meet stringent performance specs. Requires experience in optoelectronic packaging and strong thermo-mechanical understanding for reliable device lifetime.
Colwyn Group is actively seeking a Principal Laser Packaging Engineer in the San Francisco Bay Area, CA. The role centers on owning the laser package architecture for high-power PCSELs, guiding dies from concept to manufacturable, taped-out packages.
Responsibilities include thermal path design, die-attach strategy, and hardware integration to meet stringent performance specs. Requires experience in optoelectronic packaging and strong thermo-mechanical understanding for reliable device lifetime.