Packaging Engineer

Texas Instruments Incorporated; Bouchard (TX); On-site; USD 90,000 - 150,000; Full time

Job summary

Texas Instruments Incorporated is seeking a packaging engineer to develop substrates, mold compounds, and other packaging materials for power devices with a focus on datacenter and automotive applications.

The role involves collaboration with product lines, AT sites, and suppliers to define package requirements, co-design and qualify new power packages, and perform design tradeoffs to optimize performance, cost, and reliability.

Responsibilities

• Develop and enhance substrates, mold compound, and other packaging materials for power devices with focus on datacenter and automotive applications
• Collaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices
• Co-design and qualify new power packages and capabilities with various product groups
• Perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability
• Utilize thermal and mechanical modeling to aid in package technology choice and design tradeoffs
• Coordinate the introduction of new package processes into production at internal/external AT sites
• Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies Qualifications
• Work with failure analysis team to improve designs and processes

Job description

Change the world. Love your job.

As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the Package Technology Solutions organization.

Responsibilities include:

• Develop and enhance substrates, mold compound, and other packaging materials for power devices with focus on datacenter and automotive applications
• Collaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices
• Co-design and qualify new power packages and capabilities with various product groups
• Perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability
• Utilize thermal and mechanical modeling to aid in package technology choice and design tradeoffs
• Coordinate the introduction of new package processes into production at internal/external AT sites
• Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies Qualifications
• Work with failure analysis team to improve designs and processes