Power Integrity & EM Signoff Engineer for Next-Gen SoCs

Watershed

Palo Alto (CA)

In loco

USD 237.000 - 296.000

Tempo pieno

14 giorni+

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Vantaggi offerti da questo lavoro

Paid vacation
Life insurance
Medical insurance
Dental insurance
Vision insurance
Short-term disability insurance
Long-term disability insurance
401(k) Plan
Employee Stock Purchase Program

Descrizione del lavoro

Rivian is seeking a highly skilled Physical Design Engineer specializing in Power Integrity (PI) and Signoff Analysis. You will ensure electrical reliability of next-generation SoCs, bridging physical implementation and electrical verification.

Responsibilities include static/dynamic IR drop, EM analysis, and PI signoff for advanced nodes. You will develop automation scripts (Tcl/Python), stay current with EDA tools, and collaborate with PD, RTL, and packaging teams to optimize PG density and

Competenze

  • BS/MS in Electrical Engineering.
  • 10+ years of extensive physical design experiences at block/sub-chip/full-chip level is a plus.
  • Deep understanding of PDN and the physics of IR drop.
  • Proficiency in PI/Signoff tools: RedHawk-SC, Voltus, PrimePower/Rail.
  • Experience with UPF power intent and MSV designs.

Mansioni

  • Perform Static IR Drop analysis to validate power grid robustness.
  • Conduct Dynamic Voltage Drop analysis to identify hotspots during peak activity.
  • Collaborate with RTL/Architecture to optimize power at block and top levels.
  • Execute EM and Power EM analysis for long-term reliability.
  • Drive the PI signoff flow for deep sub-micron nodes (5nm, 3nm).

Conoscenze

IR drop analysis
DVD analysis
Power optimization
EM analysis
Signoff flow
Python scripting
Tcl scripting
EM-IR sign-off
Voltage drop debugging
STA impact analysis

Formazione

BS/MS in Electrical Engineering

Strumenti

Ansys RedHawk-SC
Cadence Voltus
Synopsys PrimePower/Rail

Descrizione del lavoro

Rivian is seeking a highly skilled Physical Design Engineer specializing in Power Integrity (PI) and Signoff Analysis. You will ensure electrical reliability of next-generation SoCs, bridging physical implementation and electrical verification.

Responsibilities include static/dynamic IR drop, EM analysis, and PI signoff for advanced nodes. You will develop automation scripts (Tcl/Python), stay current with EDA tools, and collaborate with PD, RTL, and packaging teams to optimize PG density and

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