Plasma Etch Process Development Engineer (FEOL/BEOL)

118-WW TMG MFG OPS; Dallas (TX); On-site; USD 85,000 - 130,000; Full time

Job summary

118-WW TMG MFG OPS is seeking a Process Development Engineer to lead the development, characterization and optimization of plasma etch unit processes (FEOL/BEOL) for semiconductor devices aimed at volume production.

The ideal candidate will be a technical leader with a Master’s in engineering and 2+ years of plasma etch experience, capable of driving robustness, reliability, and manufacturability while collaborating across multidisciplinary teams.

Qualifications

• Master's degree in Electrical Engineering or Mechanical Engineering or related field.
• 2+ years of experience in plasma etch unit processes from development to production.

Responsibilities

• Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation
• Work with multiple process, integration, reliability, packaging and test engineers to achieve goals
• Work closely with product groups to optimize dry etch unit processes to meet critical final device parameters

Skills

Plasma etch

DOE

Data analysis

Project leadership

Cross-functional collaboration

Education

Master's degree in Electrical or Mechanical Engineering or related

Job description

118-WW TMG MFG OPS is seeking a Process Development Engineer to lead the development, characterization and optimization of plasma etch unit processes (FEOL/BEOL) for semiconductor devices aimed at volume production.

The ideal candidate will be a technical leader with a Master’s in engineering and 2+ years of plasma etch experience, capable of driving robustness, reliability, and manufacturability while collaborating across multidisciplinary teams.