Dry/Plasma Etch Process Development Engineer (R&D)

118-WW TMG MFG OPS; Dallas (TX); On-site; USD 85,000 - 130,000; Full time

Job summary

118-WW TMG MFG OPS is seeking a Process Development Engineer to lead the development, characterization and optimization of plasma etch unit processes (FEOL/BEOL) for semiconductor devices aimed at volume production.

The ideal candidate will be a technical leader with a Master’s in engineering and 2+ years of plasma etch experience, capable of driving robustness, reliability, and manufacturability while collaborating across multidisciplinary teams.

Qualifications

• Master's degree in Electrical Engineering or Mechanical Engineering or related field.
• 2+ years of experience in plasma etch unit processes from development to production.

Responsibilities

• Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation
• Work with multiple process, integration, reliability, packaging and test engineers to achieve goals
• Work closely with product groups to optimize dry etch unit processes to meet critical final device parameters

Skills

Plasma etch

DOE

Data analysis

Project leadership

Cross-functional collaboration

Education

Master's degree in Electrical or Mechanical Engineering or related

Job description

Change the world. Love your job.
Process Development Engineer responsible for the development, characterization and optimization of plasma etch unit processes (FEOL/BEOL) for semiconductor devices that meet the requirements for volume production as part of the advanced technology development team. The ideal candidate will be a technical leader in the area of plasma etching driving the characterization and optimization of the device and process to insure robustness, reliability, and manufacturability meeting all electrical device performance targets.

Responsibilities include:

• Drive process and device improvements through characterization, test, design of experiments, data analysis and simulation
• Work with multiple process, integration, reliability, packaging and test engineers to achieve these goals
• Work closely with the product groups to identify and optimize the dry etch unit processes to meet critical final device parameters to enable game changing products in the market.

The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.

Minimum requirements:

• Masters in Electrical Engineering, Mechanical Engineering or related engineering degree
• 2+ years of experience working on plasma etch unit processes in the fab and taking them from development to production on schedule

Preferred qualifications:

• Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
• Strong verbal and written communication skills
• Ability to quickly ramp on new systems and processes
• Demonstrated strong interpersonal, analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on‑time project delivery