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Texas Instruments in Dallas is seeking a Process Development Engineer to advance plasma etch unit processes (FEOL/BEOL) for volume semiconductor production.
You will lead characterization, design of experiments, data analysis and cross‑functional collaboration with process, integration, reliability, packaging and test teams to deliver robust, manufacturable devices.
This role requires effective planning, scheduling and clear communication across organizations to support game‑changing products.
Process Development Engineer responsible for the development, characterization and optimization of plasma etch unit processes (FEOL/BEOL) for semiconductor devices that meet the requirements for volume production as part of the advanced technology development team. The ideal candidate will be a technical leader in the area of plasma etching driving the characterization and optimization of the device and process to insure robustness, reliability, and manufacturability meeting all electrical device performance targets.
The person performing this role must be capable to plan effectively, drive schedules, meet critical deadlines on multiple tasks in parallel, lead technical discussions in their area of expertise, and work effectively across organizational boundaries. They must be able to clearly communicate project status and actions. Additionally, they must be able to interface with multiple organizations and work well on a diverse team to accomplish goals.