Photonics Process Development Engineer – Advanced Packaging

Ny Creates; City of Rochester (NY); On-site; USD 100,000 - 135,000; Full time

Benefits offered by this job

Medical Vision Dental

Competitive Pay PTO

Flexible health spending

Retirement plan contribution

Post-Retirement Health Insurance

Employee contributed retirement plan

Job summary

NY Creates in Albany, NY hosts AIM Photonics TAP facility in Rochester, a state-of-the-art center for photonics packaging. The Process Development Engineer works hands-on with advanced solder interconnect equipment to assemble optoelectronic packages, driving robust, high-yield processes.

Responsibilities include DOE experiments, materials qualification, and close collaboration with marketing, vendors, and customers to deliver reliable packaging for high-performance photonic devices.

Qualifications

• This position requires a Bachelor's in mechanical engineering, materials science, engineering physics, or equivalent.
• 3+ years in fabrication, packaging, or semiconductor devices with fiber attach, dicing, or wire bonding.
• Preferred: Master's or PhD and cleanroom/precision equipment experience.

Responsibilities

• Develop interconnect processes and build heterogeneously integrated packages.
• Run DOE experiments to optimize machine parameters for advanced packages.
• Evaluate solder materials and ensure joint integrity.
• Work with high precision equipment and perform metrology.
• Interpret failure analyses and improve yields and device performance.

Skills

DOE experience

Attention to detail

Good communication

Education

Bachelor's degree in mechanical engineering

Bachelor's degree in materials science

Equivalent from USDOE-accredited institution

Job description

NY Creates in Albany, NY hosts AIM Photonics TAP facility in Rochester, a state-of-the-art center for photonics packaging. The Process Development Engineer works hands-on with advanced solder interconnect equipment to assemble optoelectronic packages, driving robust, high-yield processes.

Responsibilities include DOE experiments, materials qualification, and close collaboration with marketing, vendors, and customers to deliver reliable packaging for high-performance photonic devices.