Process Integrator: Co-Packaged Optics & Packaging

Applied Materials, Inc.; City of Albany (NY); On-site; USD 176,000 - 242,000; Full time

Benefits offered by this job

Stock award program

Bonus eligibility

Job summary

Applied Materials, Inc. in Albany, NY seeks an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D environment.

The role connects unit processes, materials, device requirements, metrology, reliability, and equipment capabilities into robust integrated flows. Preferred background includes co-packaged optics and photonics packaging, and a strong track record in integrating complex process flows with cross-functional teams across

Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.
• 5–10 years of experience in a semiconductor process integrator or process-integration role, with substantial experience in R&D or advanced technology development.
• Demonstrated experience building and executing integrated semiconductor or photonics process flows involving multiple process modules and cross-functional engineering teams.
• Strong understanding of CPO, silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.
• Working knowledge of photonic and electronic die integration, optical coupling and alignment, fiber attach interfaces, fine-pitch interconnects, and advanced substrate or interposer integration.
• Understanding of optical loss, alignment tolerances, thermal management, thermal-mechanical interactions, packaging-induced stress, defect mechanisms, metrology, characterization, and reliability.
• Experience planning experiments, applying statistical analysis and DOE methods, interpreting optical, electrical, physical, and reliability datasets, and converting results into clear technical decisions.
• Proven ability to lead technically complex R&D projects with ambiguity, risk, and interdependencies while maintaining execution discipline.
• Self-directed, collaborative, and comfortable working in a fast-paced global R&D organization.
• Excellent written and verbal communication skills, including the ability to explain complex CPO integration issues to diverse technical and executive audiences.

Responsibilities

• Own end-to-end process integration for advanced packaging and heterogeneous integration programs, from initial concept and architecture through demonstration and technology transfer.
• Develop integrated process flows for photonic integrated circuits, electronic ICs, optical engines, interposers, substrates, and fiber interfaces, including module sequences, process windows, control plans, and learning-cycle strategies.
• Translate optical, electrical, thermal, mechanical, reliability, and manufacturability requirements into process-integration specifications and measurable success criteria for CPO modules.
• Lead cross-functional execution across photonics, device, packaging, bonding, lithography, deposition, etch, clean, CMP, plating, metrology, optical test, electrical test, failure analysis, modeling, and reliability teams.
• Drive integration of photonic and electronic die, including die-to-wafer or wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, fiber attach interfaces, and advanced substrate or interposer integration.
• Design and execute structured experiments and DOEs to optimize optical loss, coupling efficiency, alignment tolerance, interconnect performance, thermal behavior, defectivity, yield, and reliability.
• Integrate laser, modulator, detector, waveguide, electronic IC, thermal-management, and package-level requirements into stable module and full-flow performance.
• Identify and resolve CPO integration risks such as contamination, bonding defects, overlay and alignment error, warpage, thermal-mechanical stress, optical-interface degradation, and process-induced device shifts.
• Create CPO technology roadmaps, integration reviews, risk assessments, schedules, and executive-ready reports; communicate clearly with engineers, senior leaders, customers, research partners, and suppliers.
• Identify invention opportunities, contribute to intellectual property, and establish disciplined R&D practices for CPO integration, data quality, documentation, and technical decision-making.

Skills

Process integration

DOE methods

Statistical analysis

Cross-functional collaboration

Education

MS or PhD in Materials Science/Engineering/Photonics

Tools

Metrology

Characterization

Job description

Applied Materials, Inc. in Albany, NY seeks an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D environment.

The role connects unit processes, materials, device requirements, metrology, reliability, and equipment capabilities into robust integrated flows. Preferred background includes co-packaged optics and photonics packaging, and a strong track record in integrating complex process flows with cross-functional teams across