Staff Advanced Packaging & Process Engineer – R&D

Lumentum Operations LLC; San Jose (CA); On-site; USD 112,000 - 160,000; Full time

Benefits offered by this job

Flexible time off

Health and wellness benefits

Tuition reimbursement and career grow

Gym, games room, prayer room

Stock options and incentive plans

Job summary

Lumentum Operations LLC is seeking a Staff Advanced Packaging/Process Engineer for R&D to drive cutting-edge packaging for optical and photonic devices. You will lead hands-on development, optimize processes, and collaborate across design, reliability, and manufacturing teams to enable high-volume production.

Requirements include a Master's or Ph.D. in a relevant field and 8+ years in advanced packaging, with expertise in COB, flip-chip, WLP, SiP, sealing, and optical assembly.

Qualifications

• Advanced packaging/processing experience in optoelectronics or semiconductors.
• Strong R&D background with hands-on process development and DOE/ SPC knowledge.
• Experience with multiple packaging technologies and bonding methods.

Responsibilities

• Lead design, development, and optimization of advanced packaging processes from concept to high-volume manufacturing.
• Perform hands-on process development, characterization, and troubleshooting for packaging technologies.
• Develop and implement SPC and DOE to improve yield and reliability.
• Collaborate with design, reliability, and manufacturing to transfer packaging tech to production.
• Mentor junior engineers and stay current with industry trends.

Skills

R&D focus

Analytical skills

Communication skills

Mentoring

Education

Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics

Tools

Wire bonding equipment

Reflow ovens

CAD tools

Job description

Lumentum Operations LLC is seeking a Staff Advanced Packaging/Process Engineer for R&D to drive cutting-edge packaging for optical and photonic devices. You will lead hands-on development, optimize processes, and collaborate across design, reliability, and manufacturing teams to enable high-volume production.

Requirements include a Master's or Ph.D. in a relevant field and 8+ years in advanced packaging, with expertise in COB, flip-chip, WLP, SiP, sealing, and optical assembly.