Packaging Strategy Director, MEMS & OSAT Leadership

SiTime Corp.; Santa Clara (CA); On-site; USD 239,000 - 342,000; Full time

Benefits offered by this job

401k plan

Health and wellness

Equity grants

Time off plans

Job summary

SiTime seeks a seasoned leader to drive its packaging technology roadmap, guiding execution across co-packaged MEMS and wafer-scale packaging initiatives with OSAT partners and suppliers.

The role requires strong international leadership, material selection, and collaboration with IC design teams to optimize performance, reliability, and cost. A track record in advanced packaging and process control is essential.

Qualifications

• Education: Ph.D. or Master7s in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
• Experience: 10+ years in semiconductor packaging R&D with 5+ years leading teams.
• Technical Depth: Expertise in materials, process integration, metrology, and design-for-manufacturing.
• OSAT/Foundry management: Collaboration with OSATs and semiconductor foundries.
• Global Teams: Experience managing distributed teams across locations.
• Leadership: Strong cross-functional leadership and communication skills.

Responsibilities

• Define the packaging roadmap to meet product performance, form-factor, reliability, and cost.
• Lead OSAT development collaboration and manage local teams at key OSAT sites.
• Oversee mechanical design, thermal performance, and manufacturability.
• Optimize electrical interfaces with IC design teams.
• Drive material selection and qualification of substrates and mold compounds.
• Accelerate screening in the packaging lab and evaluate materials.
• Define best practices and KPIs for package development and lifecycle.
• Develop leadership in engineers and technicians to build high-performing teams.

Skills

Leadership

Cross-functional

Strategic vision

Problem solving

Communication

English proficiency

Education

Ph.D. or Master7s in Mechanical Engineering / Materials Science / Microelectronics / Physics

Tools

EDA tool chains

Job description

SiTime seeks a seasoned leader to drive its packaging technology roadmap, guiding execution across co-packaged MEMS and wafer-scale packaging initiatives with OSAT partners and suppliers.

The role requires strong international leadership, material selection, and collaboration with IC design teams to optimize performance, reliability, and cost. A track record in advanced packaging and process control is essential.