Head of MEMS Packaging & Integration

SiTime Corp.; Santa Clara (CA); Vor Ort; USD 180.000 - 280.000; Vollzeit

Benefits dieser Stelle

401k plan

Health and wellness benefits

Equity grants

Parental leave

Time off plans

Zusammenfassung

SiTime is seeking a seasoned packaging leader to drive its advanced packaging roadmap and collaborate with OSAT partners. The role emphasizes leading teams, material selection, and process optimization to deliver thermally stable, reliable co-packaged MEMS devices.

The ideal candidate has 10+ years in semiconductor packaging R&D, with 5+ years leading distributed teams and strong collaboration with external partners. A strategic, execution-focused mindset is essential.

Qualifikationen

• Ph.D. or Master’s degree in Mechanical Engineering, Materials Science, Microelectronics, or Physics.
• 10+ years of semiconductor packaging R&D experience.
• At least 5 years leading teams focused on advanced heterogeneous integration.
• Experience collaborating with OSATs and foundries.

Aufgaben

• Define the packaging roadmap to enable product performance, form-factor, reliability and cost.
• Lead OSAT development relationships and build local teams at OSAT sites.
• Oversee mechanical design, thermal performance and manufacturability.
• Collaborate with IC design teams to optimize parasitics and signal integrity.
• Drive material selection, qualification, and supplier partnerships.
• Accelerate screening of materials and characterise package performance and reliability.
• Define best practices and KPI metrics for the packaging development lifecycle.
• Mentor and develop engineers and technicians to build high-performance teams.

Kenntnisse

Leadership

Cross-functional leadership

Team leadership

Strategic thinking

Problem solving

Ausbildung

Ph.D. or Master's in Mechanical Eng/Microelectronics/Materials/Physics

Tools

EDA Toolchains

Jobbeschreibung

SiTime is seeking a seasoned packaging leader to drive its advanced packaging roadmap and collaborate with OSAT partners. The role emphasizes leading teams, material selection, and process optimization to deliver thermally stable, reliable co-packaged MEMS devices.

The ideal candidate has 10+ years in semiconductor packaging R&D, with 5+ years leading distributed teams and strong collaboration with external partners. A strategic, execution-focused mindset is essential.