Senior MEMS Packaging Engineer: Innovation & Impact

SiTime Corp.; Santa Clara (CA); On-site; USD 140,000 - 200,000; Full time

Benefits offered by this job

401k plan

Health and wellness benefits

Equity grants

Parental leave

Time off plans

Job summary

SiTime Corp. in Santa Clara, CA seeks a Senior Semiconductor Package Engineer to lead the specification, design, development and qualification of custom packaging for MEMS timing products.

You will work with OSATs and internal teams to deliver reliable, manufacturable packages, including QFN, WLCSP, ceramic, and substrate-based modules. Ideal candidates have a MS/PhD in Mechanical Engineering or Materials Science, 5+ years in semiconductor IC packaging, and hands-on CAD experience.

Qualifications

• Requires MS/PhD in Mechanical Engineering or Materials Science.
• 5+ years in semiconductor IC packaging technology.
• Experience managing overseas OSATs to bring products into production.
• Knowledge of leadframe-based, flip-chip, and substrate-based packages.
• Experience with flip-chip and bumping technologies.
• Understanding of thermal, stress, and electrical considerations in package design.

Responsibilities

• Develop new packaging technology for SiTime’s MEMS-based timing solutions.
• Lead activities for package design, development, and release-to-production.
• Develop, manage, and analyze DoEs running locally and overseas.
• Work with OSATs to prototype and test new custom package designs.
• Ensure new technologies achieve required performance, reliability, and quality requirements.
• Lead troubleshooting activities related to package design or performance.

Skills

Semiconductor packaging knowledge

OSAT management

Thermal/electrical modeling

Flip-chip and bumping knowledge

Leadframe-based/package design

English communication

Education

MS or PhD in Mechanical Engineering or Materials Science

Tools

AutoCAD

Job description

SiTime Corp. in Santa Clara, CA seeks a Senior Semiconductor Package Engineer to lead the specification, design, development and qualification of custom packaging for MEMS timing products.

You will work with OSATs and internal teams to deliver reliable, manufacturable packages, including QFN, WLCSP, ceramic, and substrate-based modules. Ideal candidates have a MS/PhD in Mechanical Engineering or Materials Science, 5+ years in semiconductor IC packaging, and hands-on CAD experience.