Packaging Process Leader, Semiconductor Manufacturing, 24x7 Ops (AZ)

Intel Corporation; Phoenix (AZ); Presencial; USD 156.000 - 298.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Stock bonuses

Health benefits

Retirement plan

Vacation

Descripción de la vacante

Intel Corporation is seeking a Packaging Module Development Manager in Arizona to lead a high-performing engineering team in a 24x7 semiconductor packaging environment. You will drive deployment of new equipment, ensure process specifications align with goals, and partner across manufacturing and automation teams to deliver high-quality packaging solutions.

Preferred candidates will bring proven leadership, strategic problem-solving, and a track record of improving yield and throughput.

Formación

• Bachelor’s Degree in a STEM field plus 6+ years engineering/manufacturing experience.
• Master’s Degree in STEM plus 4+ years experience.
• PhD with 2+ years experience.
• Experience with semiconductor packaging processes or equipment preferred.

Responsabilidades

• Lead and develop a team of engineers in a 24x7 manufacturing environment.
• Guide deployment and optimization of new packaging equipment and processes.
• Direct specifications to meet manufacturing goals and quality standards.
• Partner with manufacturing, automation and external engineering groups.
• Formulate long-term strategies to improve yield, throughput and manufacturability.

Conocimientos

Leadership

Mentorship

Strategic planning

Cross-functional collaboration

Quality-focused

Educación

Bachelor’s Degree in STEM

Master’s Degree in STEM

PhD in STEM

Herramientas

Semiconductor equipment

DOE/Design of Experiments

SPC/Statistical data analysis

Descripción del empleo

Intel Corporation is seeking a Packaging Module Development Manager in Arizona to lead a high-performing engineering team in a 24x7 semiconductor packaging environment. You will drive deployment of new equipment, ensure process specifications align with goals, and partner across manufacturing and automation teams to deliver high-quality packaging solutions.

Preferred candidates will bring proven leadership, strategic problem-solving, and a track record of improving yield and throughput.