Packaging Module Technician – Advanced Analysis & Lab Prep

Intel Corporation; Phoenix (AZ); On-site; USD 65,000 - 75,000; Full time

Job summary

Intel Corporation's Advanced Packaging and Assembly team in Phoenix, AZ seeks a Packaging Module Engineering Technician to support development of packaging technology. This on-site role focuses on sample preparation, analytical testing, and generating data that informs process optimization and defect analysis.

You will collaborate with research engineers to operate microscopy and characterization equipment, document results, and uphold strict lab safety and quality standards.

Qualifications

• Minimum: an associate or bachelor's degree in a STEM field; no prior experience required.
• Alternate: a high school diploma (or GED) plus 1+ year in material characterization, sample prep, lab testing, or failure analysis.

Responsibilities

• Perform materials characterization and analysis using microscopy, imaging, acoustic inspection, and other analytical techniques.
• Prepare samples and coupons for testing through cross-sectioning, polishing, etching, ion milling, spin coating, and related preparation methods.
• Operate characterization and test equipment including SEM/EDS, CSAM/TSAM, optical microscopy, elemental analysis, and mechanical testing systems.
• Support material evaluations, process development activities, and failure analysis investigations.
• Collect, analyze, document, and communicate characterization results and technical findings.
• Maintain laboratory equipment through routine maintenance, calibration, and basic troubleshooting.
• Ensure compliance with laboratory safety, quality, and documentation standards.
• Collaborate with engineers and cross-functional teams to execute experiments and deliver timely analytical support.
• Perform chemical handling, wet processing, and experiments in accordance with laboratory safety protocols and environmental health and safety (EHS) requirements.

Skills

Analytical & Solution-Oriented

Collaborative Communicator

Rigorous Attention to Detail

Growth Mindset

Education

Associate or Bachelor's degree in STEM

High School Diploma/GED + 1+ years materials characterization

Tools

SEM/EDS

CSAM/TSAM

Optical Microscopy

Ion Milling

Spin Coating

Job description

Intel Corporation's Advanced Packaging and Assembly team in Phoenix, AZ seeks a Packaging Module Engineering Technician to support development of packaging technology. This on-site role focuses on sample preparation, analytical testing, and generating data that informs process optimization and defect analysis.

You will collaborate with research engineers to operate microscopy and characterization equipment, document results, and uphold strict lab safety and quality standards.