Packaging Innovation Architect: 2.5D/3D Hybrid Bonding

Applied Materials, Inc.

Santa Clara (CA)

On-site

USD 161,000 - 221,000

Full time

14 days+
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Job summary

Applied Materials, Inc. in Santa Clara is seeking an Advanced Packaging Integration Engineer to lead process integration for high‑performance interconnects and micro‑LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while collaborating with fabs, OSATs, suppliers, and cross‑functional teams across design, process, integration, and metrology.

The role requires a Ph.D. or M.S.

Qualifications

  • Ph.D. or M.S. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.
  • In-depth knowledge of advanced packaging technologies (wafer-to-wafer/ die-to-wafer hybrid bonding, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, OSAT).
  • Micro-LED or CPO experience is a plus.
  • Strong communication and interpersonal skills; able to collaborate across multidisciplinary teams.
  • Proficient in statistical data analysis and process optimization (DOE, SPC, JMP).
  • Coding capability is a plus; MES experience is a plus.

Responsibilities

  • Define, develop, and optimize advanced packaging process integration flows.
  • Own, manage, and drive complex technical projects with on-time delivery.
  • Design experiments and analyze data to drive root-cause analysis and corrective actions.
  • Collaborate with foundries, OSATs, and internal teams to improve strategies.
  • Stay abreast of latest field advancements and apply knowledge to drive innovations.

Skills

Communication skills
Problem solving
Cross-functional collaboration
Data analysis
Design of Experiments

Education

Ph.D. or M.S. in STEM

Tools

MES systems
Coding

Job description

Applied Materials, Inc. in Santa Clara is seeking an Advanced Packaging Integration Engineer to lead process integration for high‑performance interconnects and micro‑LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while collaborating with fabs, OSATs, suppliers, and cross‑functional teams across design, process, integration, and metrology.

The role requires a Ph.D. or M.S.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Advanced Packaging & 3D Integration Engineer
Advanced Packaging & 3D Integration Engineer

Applied Materials • Santa Clara (CA)

On-site
USD 138,000 - 190,000
Comprehensive benefits package
Opportunities for professional growth
Relocation assistance
Process Engineer - D2W Hybrid Bonding & 3D Packaging
Process Engineer - D2W Hybrid Bonding & 3D Packaging

Applied Materials, Inc. • Santa Clara (CA)

On-site
USD 147,000 - 203,000
Bonus program
Stock awards
Relocation assistance
Process Integration Engineer - Advanced Packaging (2.5D/3D)
Process Integration Engineer - Advanced Packaging (2.5D/3D)

1000 Micron Technology, Inc. • Idaho City (ID)

On-site
USD 120,000 - 170,000
Medical, dental, and vision plans
Paid time off
Paid holidays
Process Integration Engineer, Advanced Packaging (2.5D/3D)
Process Integration Engineer, Advanced Packaging (2.5D/3D)

Micron Technology • Boise (ID)

On-site
USD 120,000 - 180,000
Lead 3D Integration & Quantum Packaging Engineer
Lead 3D Integration & Quantum Packaging Engineer

Applied Materials • United States

On-site
USD 108,000 - 149,000
Bonus eligibility
Stock award program
Process Integration Engineer: 2.5D/3D Packaging & HBM
Process Integration Engineer: 2.5D/3D Packaging & HBM

Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Medical/Dental/Vision plans
Paid time off & holidays
Relocation assistance
3D Packaging Engineer - Advanced Packaging Innovator
3D Packaging Engineer - Advanced Packaging Innovator

Advanced Micro Devices • Austin (TX)

On-site
USD 120,000 - 170,000
Advanced Packaging Research Engineer: Chiplets & 3DIC
Advanced Packaging Research Engineer: Chiplets & 3DIC

Intel • Hillsboro (OR)

Hybrid
USD 122,000 - 232,000
Advanced Packaging Integration Engineer
Advanced Packaging Integration Engineer

Applied Materials • Santa Clara (CA)

On-site
USD 138,000 - 190,000
Comprehensive benefits package
Opportunities for professional growth
Relocation assistance
Director, Advanced Packaging: 2.5D/3D & HBM Integration
Director, Advanced Packaging: 2.5D/3D & HBM Integration

Micron Technology • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, dental, vision plans
Paid time off
Paid holidays