Packaging Module Equipment Development Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 115,000 - 220,000; Full time

Job summary

Intel Corporation in the United States (Arizona, Phoenix) seeks an experienced engineer to develop and optimize assembly processes and equipment for future packaging technologies. You will drive quality, cost, yield, and reliability while documenting improvements and interfacing with suppliers and internal teams.

A strong emphasis on DOE/experimentation is required, with on-site work essential. You will lead cross-functional projects, apply SPC and DOE principles, and maintain equipment used to

Qualifications

• Bachelor's degree in Engineering, Physics, Chemistry or related STEM field with 6+ years of industry experience.
• Master's degree in Engineering, Physics, Chemistry or related STEM field with 3+ years of industry experience.
• PhD degree in Engineering, Physics, Chemistry or related STEM field with 6+ months of industry experience.

Responsibilities

• Develops and optimizes assembly processes and equipment to meet quality, cost, and reliability goals.
• Sets specifications and conducts DOE/experiments to drive process improvements.
• Maintains equipment for evaluating silicon and package technologies under simulated field conditions.
• Collaborates with suppliers and internal teams to ensure manufacturability and vendor performance.
• Leads projects using SPC and DOE to deliver time-critical results.

Skills

Project management

Statistical methods

Design of Experiments (DOE)

Statistical Process Control (SPC)

Problem solving

Education

Bachelor's degree in Engineering, Physics, Chemistry or related STEM field

Master's degree in Engineering, Physics, Chemistry or related STEM field

PhD degree in Engineering, Physics, Chemistry or related STEM field

Tools

Dispense equipment

Mold equipment

Cure equipment

Process instrumentation

Job description

Job Details

Develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones. Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Qualifications

Minimum Qualifications: The candidate must have Bachelor's degree in Engineering, Physics, Chemistry or related STEM field with 6+ years of industry experience -OR- Master's degree in Engineering, Physics, Chemistry or related STEM field with 3+ years of industry experience -OR- PhD degree in Engineering, Physics, Chemistry or related STEM field with 6+ months of industry experience

Preferred Qualifications

• Semiconductor specific experience or research with hands-on equipment support or development.
• Equipment selection and first time process and manufacturing integration.
• Preference for experience with dispense, mold, and/or cure equipment technologies.
• Equipment sustaining, change control management and quality data systems.
• Project management and delivering results for time critical technical projects.
• Technical innovation and deliver results for complex, time critical technical projects.
• Semiconductor fabrication processes and technology.
• Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Position of Trust N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.

We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.