Module Engineer On-Shift (MEOS) – Night Shift (4)

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 85,000 - 140,000; Full time

Benefits offered by this job

Competitive pay and bonuses

Stock options

Health, retirement, and vacation plans

Job summary

Intel Corporation in Chandler, Arizona is seeking a Module Engineer On Shift to support 24x7 operations on the factory floor, solving equipment and process challenges and ensuring continuous lot movement.

You will work on night shift, perform troubleshooting, document specs, communicate with tool owners, and contribute to process improvements in semiconductor packaging.

Qualifications

• Bachelor's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or related field with 1+ years of experience OR Master's degree in same fields.
• Experience with SPC methodologies is preferred.
• Entry-level position with potential for growth in semiconductor packaging.

Responsibilities

• Provide hands-on, real-time floor support for equipment, process, and product issues to maintain 24x7 lot movement.
• Receive and deliver shift pass-downs; align priorities with management at shift start.
• Troubleshoot and recover from errors; support new tool enabling activities.
• Write and update specifications and RFCs as required to maintain process records.
• Perform inspections and imaging on panels to collect development data.
• Communicate with Tool and Lot Owners regarding key issues for timely resolution.
• Perform ad-hoc duties within the assigned functional area.

Skills

Problem-solving

Clear communication

Adaptability

Self-motivation

Team mindset

Education

Bachelor's in materials/ mechanical/ chemical/ physics or related

Master's in materials/ mechanical/ chemical/ physics or related

Tools

Statistical Process Control (SPC)

Job description

## Job Description:Intel Corporation is one of the world's leading semiconductor companies, dedicated to creating technology that changes the world. From powering the cloud to enabling AI, autonomous vehicles, and next-generation computing, Intel's innovations touch nearly every aspect of modern life. With a culture built on curiosity, collaboration, and a relentless drive to push boundaries, Intel offers engineers the opportunity to do the most meaningful work of their careers.Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge and affordable substrate packaging solutions. As a critical part of Intel's advanced manufacturing ecosystem, the SPTD team is driving the future of semiconductor packaging — and we're looking for talented engineers to help us get there.We are seeking a motivated and technically skilled Module Engineer On Shift (MEOS) to join our SPTD team at our state-of-the-art facility in Chandler, Arizona. In this role, you will be a critical part of our 24x7 manufacturing operation, providing real-time support to ensure seamless lot movement through the production line. You'll work directly on the factory floor, solving complex equipment and process challenges, and collaborating with a talented team of engineers and technicians.**Shift 4 Details:*** **Hours:** 6:00 PM – 6:00 AM (Night Shift)* **Schedule:** Alternating 3- and 4-day work weeks (Sunday–Tuesday, with alternating Saturdays) — giving you more days off than a traditional 5-day schedule!This position is based in Arizona. Compensation for this role will be determined in accordance with the applicable salary range for the Arizona work location, as well as factors such as skills, qualifications, and experience.**Key Responsibilities:*** **Factory Floor Support:** Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous 24x7 lot movement through the manufacturing line.* **Shift Communication:** Receive written and verbal pass-downs from outgoing shift peers; deliver comprehensive, quality pass-downs to incoming shift teams; align priorities with management at the start of each shift.* **Troubleshooting & Error Recovery:** Respond promptly to process issues, perform error recovery, manage lot disposition, and support new tool enabling activities.* **Documentation:** Write and update specifications and RFCs (Request for Change) as required to maintain accurate and current process records.* **Inspection & Imaging:** Execute non-standard procedures and perform inspection and imaging on panels to collect critical development data.* **Stakeholder Communication:** Communicate effectively via email with Tool and Lot Owners regarding key issues, ensuring timely resolution and transparency.* **Ad-Hoc Support:** Perform a variety of ad-hoc duties as required by the factory within your specific functional area.**As a Successful Candidate, You Will Bring:*** **Strong problem-solving instincts** — you approach challenges with curiosity and persistence* **Clear and confident communication** — you can articulate complex issues clearly to peers, engineers, and stakeholders* **Adaptability** — you thrive in a dynamic environment and can pivot quickly when priorities shift* **Self-motivation and initiative** — you take ownership of your work and don't wait to be told what to do next* **Team-oriented mindset** — you support your colleagues and contribute to a positive, collaborative shift cultureIf you're ready to work on technology that matters — and join a team that's shaping the future of semiconductor packaging — we'd love to hear from you.## **Qualifications:**This is an entry level position. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship. **Minimum Qualifications:*** Bachelor's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline with 1+ years of relevant industry experience OR* Master's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline**Preferred Qualifications:*** 1+ years of experience: + Applying Statistical Process Control (SPC) methodologies in a manufacturing environment + Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing## Job Type:Experienced Hire## Shift:Shift 4 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $85,200.00-139,810.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.