Onsite Packaging Module Engineer – Wafer-Level & Tech Transfers

Intel Corporation; Rio Rancho (NM); On-site; USD 76,000 - 146,000; Full time

Job summary

Intel Corporation in New Mexico is seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology to support high-volume manufacturing and technology development, including transfers and startups for Foveros, Embedded Bridge, and Intel Foundry Services.

You will collaborate with partner factories, develop technology roadmaps, install and qualify equipment, and drive continuous improvements while ensuring safety and adherence to Copy Exactly standards.

Qualifications

• Bachelor's degree in a technical field as listed.
• Completed coursework in semiconductor technologies or related engineering disciplines.
• Experience with DOE, MBPS, SPC, or FMEA preferred.

Responsibilities

• Drive safety improvements and equipment availability across operations.
• Transfer processes with partner factories and maintain Copy Exactly standards.
• Develop technology roadmaps to meet process requirements and milestones.
• Install and ramp equipment for new products and pilot lines.
• Lead cross-functional teams to resolve technical challenges.

Skills

Semiconductor process knowledge

DOE methodologies

MBPS (Model-Based Problem Solving)

SPC

FMEA

Data-driven problem solving

Education

Bachelor's degree in Materials Science and Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Electrical Engineering

Job description

Intel Corporation in New Mexico is seeking Module Engineers specializing in Wafer-Level Assembly, Die Preparation, and Metrology to support high-volume manufacturing and technology development, including transfers and startups for Foveros, Embedded Bridge, and Intel Foundry Services.

You will collaborate with partner factories, develop technology roadmaps, install and qualify equipment, and drive continuous improvements while ensuring safety and adherence to Copy Exactly standards.