Microelectronics Manufacturing Engineer - Die Bonding

Stellant Systems, Inc.; Torrance (CA); On-site; USD 80,000 - 130,000; Full time

Benefits offered by this job

Job summary

Stellant Systems, Inc. in Torrance, California is seeking a Manufacturing Engineer with hands-on experience in microelectronics assembly to join our production facility.

You will blend technical expertise with project leadership on high-visibility programs, supporting die-bonding, wire bonding, and related PCBAs. The role requires collaboration across teams, a proactive mindset, and the ability to work under a microscope.

Qualifications

• Combination of PCBAs, microelectronics, or related manufacturing experience.
• Bachelor's degree in Mechanical, Manufacturing, or Electrical Engineering required.
• Hands-on experience with die-bonding and wire-bonding processes.

Responsibilities

• Support production learning and optimization of die-bonding and wire-bonding processes.
• Qualify new products and lines at Torrance site.
• Collaborate with cross-functional teams to develop wire bond solutions.
• Provide training in die-assembly and wire bond technology.

Skills

Die-bonding

Wire bonding

PCBAs

Microelectronics

Manufacturing engineering

Education

Bachelor's degree in Mechanical, Manufacturing, or Electrical Engineering

Tools

Die attach equipment

Pick-and-place

Wire-bonding machines

Job description

Stellant Systems, Inc. in Torrance, California is seeking a Manufacturing Engineer with hands-on experience in microelectronics assembly to join our production facility.

You will blend technical expertise with project leadership on high-visibility programs, supporting die-bonding, wire bonding, and related PCBAs. The role requires collaboration across teams, a proactive mindset, and the ability to work under a microscope.