Onsite Micro Assembler B: Die/Wire Bonding Expert

Power Device Corp; Bohemia (NY); On-site; USD 33,000 - 39,000; Full time

Job summary

Power Device Corporation in Bohemia, NY is seeking a Micro Assembler B to perform moderately complex assembly operations with increased independence. The role involves die bonding, wire bonding, header assembly, and reading complex drawings to produce high-reliability components for aerospace, defense, and space applications.

Responsibilities include mentoring junior teammates, conducting regular quality checks, meeting production goals, and communicating issues to supervisors.

Qualifications

• 3+ years of micro-assembly or related experience.
• Strong manual dexterity and precision handling of small components.
• Ability to read and interpret detailed assembly drawings and documentation.
• Experience with die bonding, wire bonding and header assembly.
• Ability to train and mentor less experienced team members.

Responsibilities

• Perform a variety of assembly operations, including die bonding, wire bonding, header assembly, and other complex operations, under minimal supervision.
• Use small hand tools, microscopes, and other automated equipment to complete assembly tasks.
• Read and interpret detailed assembly drawings and documentation to ensure correct procedures and sequences are followed.
• Mentor and assist junior team members (Micro Assembler C) to develop skills and meet department goals.
• Conduct regular quality checks and troubleshooting of assemblies.
• Actively contribute to meeting department production goals and quality standards.
• Communicate effectively with supervisors and team leads to address issues and improve processes.

Skills

Die bonding

Wire bonding

Header assembly

Manual dexterity

Reading assembly drawings

Quality troubleshooting

Mentoring junior

Tools

Microscopes

Job description

Power Device Corporation in Bohemia, NY is seeking a Micro Assembler B to perform moderately complex assembly operations with increased independence. The role involves die bonding, wire bonding, header assembly, and reading complex drawings to produce high-reliability components for aerospace, defense, and space applications.

Responsibilities include mentoring junior teammates, conducting regular quality checks, meeting production goals, and communicating issues to supervisors.