Lead Die Bonding Process Engineer

Micron Technology

Boise (ID)

On-site

USD 120,000 - 190,000

Full time

3 days ago

Be an early applicant

Application generator

Turn this role into an interview — a resume and cover letter built around what this employer wants.

Get past ATS filters

Job summary

Micron Technology is a world leader in memory and storage solutions, seeking a Principal Process Engineer in Die Bonding to start up, develop, and optimize processes for high quality and reliability. You'll tackle yield improvement, cost reduction, productivity, and risk management while applying failure analysis, DOE, and SPC methods.

Responsibilities include leading process evaluation, coordinating equipment/material changes, and ensuring supplier quality.

Qualifications

BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering.
Solid engineering knowledge of semiconductor advanced packaging die stacking processes.
Skilled at designing valid tests and Design of Experiments (DOE).
Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs.
Knowledge and an understanding of project management and experience leveraging AI to design experiments.

Responsibilities

Develop, diagnose, and resolve various die bonding process technologies.
Coordinate and manage process, equipment, and material evaluation/optimization initiatives and implement changes at process step.
Lead and participate in continuous yield improvement and cost reduction activities.
Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction.
Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives.
Support SPC/FDC/RMS/APC and site-to-site portability
Support internal and external audits.