Assembler - Wire Bonder - 2nd Shift

Lockheed Martin; Chelmsford (MA); On-site; USD 47,000 - 88,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) match

Paid time off

Holidays

Parental Leave

Flexible schedules

Job summary

Lockheed Martin Missiles & Fire Control in Chelmsford, MA is seeking a Microelectronic Bonder to perform high-precision wire-bonding and hybrid circuit fabrication for critical defense systems.

You will work with small pad sizes, diverse substrates, and strict quality standards in a team environment, with opportunities for professional growth and comprehensive benefits. Candidates must be U.S. citizens and able to obtain a Secret clearance.

Qualifications

• Ability to work 10 hours under a microscope and use hand tools.
• Good dexterity and eye/hand coordination.
• Experience in wirebonding and/or ribbon bonding (0.001” and 0.0007” wire).
• Experience in microelectronics assembly (chip and wire assembly).
• Ability to read and work from detailed work instructions and drawings; computer skills required.
• Ability to work in a team environment; strong interpersonal and communication skills.
• Ability to obtain and maintain a Secret Security Clearance, which requires U.S. citizenship.

Responsibilities

• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
• Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement.

Skills

Wirebonding

Ribbon bonding

Microelectronics assembly

Reading drawings

Teamwork

Secret clearance

Citizenship required

Microscope work

Tools

Westbond bonding machine

Metcal bonding machine

Unitech welder

Auto pick-and-place

Job description

Standard Job Description

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement. Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds or chip placement. Electrically troubleshoots hybrid circuitry using an ohmmeter. Performs final assembly operations including attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Performs thick film screen, dry, and fire operations of various types.

You will be the Microelectronic Bonder for Lockheed Martin Missiles & Fire Control in Chelmsford, MA. Our team is responsible for fabricating and modifying hybrid microcircuits and sub‑assemblies that support critical defense systems.

What You Will Be Doing

As the Microelectronic Bonder, you will be responsible for executing high‑precision wire‑bonding and hybrid circuit fabrication tasks.

Your Responsibilities Will Include, But Are Not Limited To

• Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
• Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
• Requires the capability to troubleshoot defective hybrids by visual or mechanical screening, wirebonds, or chip placement.

Why Join Us

We offer a purpose‑driven environment where your expertise directly contributes to mission‑critical technology. You’ll work alongside skilled professionals and have access to a comprehensive benefits package.

Further Information About This Opportunity

This position is in Chelmsford. Discover more about our Chelmsford, Massachusetts location.

MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance. A company‑sponsored interim Secret clearance is required to start.

Basic Qualifications

• Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
• Good dexterity and eye/hand coordination
• Experience in wirebonding and/or ribbon bonding (0.001” and 0.0007” wire and various sizes of ribbon)
• Experience in microelectronics assembly (chip and wire assembly)
• Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions as well as other job activities
• Ability to work in a team environment; good interpersonal, team and communication skills
• Ability to obtain and maintain a Secret Security Clearance, which requires U.S. citizenship

Desired Skills

• Experience in hybrid assembly in accordance with Mil STD 883
• Experience wirebonding or ribbon bonding to ceramic or duroid substrates
• Experience using Westbond and Metcal bonding machines and Unitech welder
• Experience in substrate and component attach, auto pick-and-place
• Experience operating auto or manual bonding equipment
• Familiarity working in an ESD and FOD controlled environment
• Experience in mechanical assembly processes of small electronic devices
• Experience working on military products in ISO 9001 / AS9100 controlled environments

Pay Information

Full-Time Salary Range: $47100.00 - $87500.00

At Lockheed Martin, we know mission success starts with taking care of our people. Our Total Rewards program is designed to attract top talent, support your well-being, and help you grow—both professionally and personally.

The salary range for this position is as listed on the requisition. Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/ training, key skills as well as market(work location) and business considerations when extending an offer.

Benefits offered:

Medical, Dental, Vision, Flexible work arrangements and schedules (e.g., 4x10), 401(k) match, Paid time off, Holidays, Parental Leave, EAP, Flexible Spending Accounts, Education Assistance, Life Insurance, Short-Term Disability, and Long-Term Disability.

• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.
• For (Washington state applicants only) Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays. Represented full time employees accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays. PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.