Memory Packaging Engineer: High-Bandwidth, High-Density

Apple; United States; On-site; USD 140,000 - 230,000; Full time

Job summary

Apple is seeking a Memory Packaging Engineer to architect memory solutions powering its high-performance hardware. You will drive the definition, development, and qualification of next-generation memory packages and guide roadmaps with memory partners, collaborating with internal teams to enable bandwidth and density scaling.

Your ownership spans the entire product lifecycle, from initial concept through qualification, with a focus on SI/PI co-design and mitigating thermal challenges in

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or PhD preferred, with 10+ years of industry experience in package design and assembly process development.

Responsibilities

• Define memory packaging architecture and roadmaps.
• Collaborate with memory die design teams and internal engineering groups.
• Oversee qualification from concept to production for high-bandwidth memory packages.

Skills

Memory packaging

Interconnect design

System integration

Co-design

Vendor collaboration

Education

Bachelor's degree in Electrical Engineering or related field

Master's degree

PhD

Tools

Wirebond

Flip-chip

Wafer/die bonding

Job description

Apple is seeking a Memory Packaging Engineer to architect memory solutions powering its high-performance hardware. You will drive the definition, development, and qualification of next-generation memory packages and guide roadmaps with memory partners, collaborating with internal teams to enable bandwidth and density scaling.

Your ownership spans the entire product lifecycle, from initial concept through qualification, with a focus on SI/PI co-design and mitigating thermal challenges in