Memory Packaging Engineer

Apple, Inc.; United States; On-site; USD 185,000 - 325,000; Full time

Benefits offered by this job

Stock options

Employee stock purchase plan

RSU eligibility

Medical and dental coverage

Retirement plan

Relocation assistance

Job summary

Apple, Inc. in the San Francisco Bay Area is seeking a Memory Packaging Engineer to architect memory solutions powering next-gen Apple hardware. You will drive the memory package lifecycle from concept to qualification, collaborating with internal teams and external vendors.

You will define architectures, coordinate with mechanical, electrical, and thermal teams, and push for high-bandwidth, low-power designs. Excellent communication and deep packaging expertise are essential.

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or PhD preferred, with 10+ years in package design and assembly.
• Expertise in thin-die stacking technologies such as wirebond, flip-chip, and wafer/die bonding.
• Strong knowledge of packaging materials and design to manage warpage and CTE.
• Experience in package test, reliability, and system-level interactions.
• Deep understanding of SI/PI co-design with memory die and high-speed signaling.

Responsibilities

• Define next-generation memory package architecture by evaluating technologies.
• Collaborate cross-functionally to solve electrical, mechanical, and thermal challenges.
• Drive vendor DOEs and failure analysis to improve yield and reliability.
• Define the memory package plan of record: form factor, process, layout, BOM.
• Guide memory vendors to develop materials and technologies for advanced designs.

Skills

10+ years experience

Strong communication

Thin-die stacking

Wirebond / Flip-chip

Wafer/die bonding

Packaging materials knowledge

Reliability / test understanding

Education

BS degree

MS or PhD preferred

Job description

San Francisco Bay Area, California, United States Hardware

Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.

Description

In this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple’s future products.You will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling.Your ownership will span the entire product lifecycle, from initial concept through qualification.

Responsibilities

• Determine the direction of next-generation package architecture by evaluating available and emerging packaging technologies.
• Collaborate with cross-functional teams to solve integration challenges, including electrical, mechanical, and thermal.
• Drive vendor DOEs and failure analysis to improve downstream yield and maintain world-class quality and reliability.
• Define the memory package POR (plan of record): Package form factor, process, layout, stackup, and bill of materials (BOM).
• Drive memory vendors to develop package materials and technology for leading-edge package design rules.

Minimum Qualifications

• BS and 10+ years of relevant industry experience.

Preferred Qualifications

• MS or PhD preferred, with 10+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.
• Strong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding.
• Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.
• Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
• Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.
• Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.
• Excellent communication skills for collaborating with internal teams and managing external vendors.

At Apple, base pay range for this role is between $184,700 and $324,800, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs.

Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan.

You’ll also receive benefits including:

• Comprehensive medical and dental coverage
• Retirement benefits
• A range of discounted products and free services
• Reimbursement for certain educational expenses — including tuition
• This role might be eligible for discretionary bonuses or commission payments as well as relocation
• Learn more about Apple Benefits

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

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Apple accepts applications to this posting on an ongoing basis.