Memory Packaging Engineer — Drive Next-Gen High-BW Packages

Apple Inc.; Santa Clara (CA); On-site; USD 129,300 - 225,300; Full time

Job summary

Apple Inc. in Santa Clara, CA is seeking a Memory Packaging Engineer to architect memory solutions powering high-performance hardware.

You will guide package roadmaps, collaborate with internal teams, and own the product lifecycle from concept through qualification. The ideal candidate has a bachelor's degree in a related field; advanced degrees and 3+ years in high-density memory packaging, wirebond/flip-chip experience, and solid reliability know-how are preferred.

Qualifications

• Bachelor's degree in a relevant field required.
• MS or PhD preferred with 3+ years in package design and assembly process development.

Responsibilities

• Determine next-generation memory package architecture and select technologies.
• Collaborate with electrical, mechanical, and thermal teams to solve integration challenges.

Skills

Memory packaging

Cross-functional collaboration

Communication

Reliability testing

Education

Bachelor's degree in a related field

MS or PhD preferred

Job description

Apple Inc. in Santa Clara, CA is seeking a Memory Packaging Engineer to architect memory solutions powering high-performance hardware.

You will guide package roadmaps, collaborate with internal teams, and own the product lifecycle from concept through qualification. The ideal candidate has a bachelor's degree in a related field; advanced degrees and 3+ years in high-density memory packaging, wirebond/flip-chip experience, and solid reliability know-how are preferred.