Lead Memory Package Design Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, Dental, Vision

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a Senior Package Design Engineer to lead advanced memory packaging initiatives.

You will drive floorplanning, high-density routing, and package layouts from concept through high-volume manufacturing, partnering with silicon teams, OSATs, and supply chains. You will leverage SI/PI simulations, optimize substrate stack-ups, and guide DFMEAups to ensure robust, scalable designs for AI, data center, and edge applications.

Qualifications

• Bachelor's degree in Electrical/Mechanical/Materials Science or related field; 5+ years of semiconductor package design experience
• Master's degree +3 years in semiconductor package design preferred
• Hands-on proficiency with advanced package EDA tools (Cadence Allegro Package Designer+, Cadence Integrity 3D-IC, Siemens/Mentor Xpedition)

Responsibilities

• Lead floorplanning, high-density routing, placement and package layout for advanced memory packages
• Define substrate stack-ups, wire bond and flip chip interconnect schemes, BEOL/RDL flows
• Drive design decisions with SI/PI simulations and feasibility studies

Skills

Package design

EDA tools

Flip chip interconnects

BEOL/RDL flows

OSAT collaboration

DFMEA

Education

Bachelor's degree in Electrical Engineering

Master's degree (preferred) in EE/related

Tools

Cadence Allegro Package Designer+

Cadence Integrity 3D-IC

Siemens/Mentor Xpedition

Job description

Micron Technology, Inc. is seeking a Senior Package Design Engineer to lead advanced memory packaging initiatives.

You will drive floorplanning, high-density routing, and package layouts from concept through high-volume manufacturing, partnering with silicon teams, OSATs, and supply chains. You will leverage SI/PI simulations, optimize substrate stack-ups, and guide DFMEAups to ensure robust, scalable designs for AI, data center, and edge applications.