Memory Packaging Architect for High-Bandwidth Systems

Apple, Inc.; Austin (TX); On-site; USD 150,000 - 190,000; Full time

Job summary

Apple Inc. in Austin, TX is seeking a Memory Packaging Engineer to architect memory solutions powering industry-leading hardware performance. You will guide the memory package roadmaps and collaborate with internal teams to enable bandwidth and density scaling from concept through qualification.

You will work with cross-functional partners to address electrical, mechanical, and thermal challenges, drive vendor DFEs, and ensure quality and reliability across the product lifecycle.

Qualifications

• BS degree in a relevant field is required; MS/PhD preferred for advanced roles.
• 10+ years of relevant industry experience in memory packaging and assembly.
• Strong knowledge of packaging materials, warpage, CTE, and thermal mitigation.

Responsibilities

• Determine the direction of next-generation memory package architecture by evaluating packaging technologies.
• Collaborate with cross-functional teams to solve integration challenges including electrical, mechanical, and thermal aspects.
• Drive vendor DOEs and failure analysis to improve downstream yield and reliability.
• Define the memory package plan of record: form factor, process, layout, stackup, and BOM.
• Drive memory vendors to develop materials and technology for leading-edge package designs.

Skills

Memory packaging

Thin-die stacking technologies

Wirebond

Flip-chip

Wafer/die bonding

SI/PI co-design

Communication skills

Education

BS degree in relevant field

MS or PhD preferred

Job description

Apple Inc. in Austin, TX is seeking a Memory Packaging Engineer to architect memory solutions powering industry-leading hardware performance. You will guide the memory package roadmaps and collaborate with internal teams to enable bandwidth and density scaling from concept through qualification.

You will work with cross-functional partners to address electrical, mechanical, and thermal challenges, drive vendor DFEs, and ensure quality and reliability across the product lifecycle.