Memory Packaging Engineer

Apple, Inc.; Austin (TX); On-site; USD 150,000 - 190,000; Full time

Job summary

Apple Inc. in Austin, TX is seeking a Memory Packaging Engineer to architect memory solutions powering industry-leading hardware performance. You will guide the memory package roadmaps and collaborate with internal teams to enable bandwidth and density scaling from concept through qualification.

You will work with cross-functional partners to address electrical, mechanical, and thermal challenges, drive vendor DFEs, and ensure quality and reliability across the product lifecycle.

Qualifications

• BS degree in a relevant field is required; MS/PhD preferred for advanced roles.
• 10+ years of relevant industry experience in memory packaging and assembly.
• Strong knowledge of packaging materials, warpage, CTE, and thermal mitigation.

Responsibilities

• Determine the direction of next-generation memory package architecture by evaluating packaging technologies.
• Collaborate with cross-functional teams to solve integration challenges including electrical, mechanical, and thermal aspects.
• Drive vendor DOEs and failure analysis to improve downstream yield and reliability.
• Define the memory package plan of record: form factor, process, layout, stackup, and BOM.
• Drive memory vendors to develop materials and technology for leading-edge package designs.

Skills

Memory packaging

Thin-die stacking technologies

Wirebond

Flip-chip

Wafer/die bonding

SI/PI co-design

Communication skills

Education

BS degree in relevant field

MS or PhD preferred

Job description

Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer, you will architect the memory solutions that power the industry-leading performance of Apple's hardware. We push the boundaries of bandwidth density, power efficiency, and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industry's toughest packaging challenges, your work will have a profound and lasting impact on the products used by millions.

Description

In this role, you will drive the definition, development, and qualification of next-generation memory packages critical to Apple’s future products.You will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density scaling.Your ownership will span the entire product lifecycle, from initial concept through qualification.

Responsibilities

• Determine the direction of next-generation package architecture by evaluating available and emerging packaging technologies.
• Collaborate with cross-functional teams to solve integration challenges, including electrical, mechanical, and thermal.
• Drive vendor DOEs and failure analysis to improve downstream yield and maintain world-class quality and reliability.
• Define the memory package POR (plan of record): Package form factor, process, layout, stackup, and bill of materials (BOM).
• Drive memory vendors to develop package materials and technology for leading-edge package design rules.

Minimum Qualifications

• BS and 10+ years of relevant industry experience.

Preferred Qualifications

• MS or PhD preferred, with 10+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.
• Strong knowledge of thin-die stacking technologies including wirebond, flip-chip, and wafer/die bonding.
• Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.
• Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
• Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.
• Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.
• Excellent communication skills for collaborating with internal teams and managing external vendors.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

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Apple accepts applications to this posting on an ongoing basis.