Manufacturing Process Engineer – RF PCBs & Laser Etch

Northrop Grumman; United States; On-site; USD 80,000 - 148,000; Full time

Benefits offered by this job

Health insurance

PTO

Life insurance

Savings plan

Job summary

Northrop Grumman is seeking a Manufacturing Process Engineer for the AIMS cell to advance laser etch, PCB, manifolds, and backplanes for RF hardware. The role emphasizes process development, optimization, and documentation to ensure production readiness with quality and cost targets.

Responsibilities include creating project plans, supporting with training, and solving manufacturing issues. Domestic travel up to 10% is expected, and a Secret clearance is required or obtainable.

Qualifications

• Bachelor of Science degree in Engineering or related STEM area with a minimum of 2 years of relevant experience (1 year with MS).
• Experience with multi-layered circuit boards.
• DOE, SPC, 6 sigma concepts for process development and control.
• GD&T experience.

Responsibilities

• Process Development: develop or maintain manufacturing processes with focus on affordability.
• Create and manage project plans for process development activities.
• Provide ROI justification for process improvements.
• Specify, identify and procure new manufacturing equipment for production readiness.

Skills

Process engineering

DOE

SPC

GD&T

MS Office

US Citizenship

Education

B.S. in Engineering

Tools

MS Office

Job description

Northrop Grumman is seeking a Manufacturing Process Engineer for the AIMS cell to advance laser etch, PCB, manifolds, and backplanes for RF hardware. The role emphasizes process development, optimization, and documentation to ensure production readiness with quality and cost targets.

Responsibilities include creating project plans, supporting with training, and solving manufacturing issues. Domestic travel up to 10% is expected, and a Secret clearance is required or obtainable.