Principal Manufacturing Engineer — Secret Clearance (RF PCB)

Northrop Grumman Corp.; Baltimore (MD); On-site; USD 80,000 - 148,000; Full time

Job summary

Northrop Grumman Mission Systems is seeking a Manufacturing Engineer for the Advanced Interconnects and Multilayer Solutions (AIMS) cell in Maryland. The role provides manufacturing technical leadership to fabricate printed wiring boards, manifolds, and backplanes for next-generation RF hardware, focusing on drilling/routing processes.

The position requires strong communication, fast-paced teamwork, and the ability to influence design for manufacturability across cross-functional teams.

Qualifications

• Bachelor of Science in Engineering or related STEM with required experience.
• Experience with multi-layered circuit boards and drilling, CMM, routing processes.
• Familiarity with DOE, SPC, and six-sigma concepts for process development.
• Knowledge of GD&T and MS Office is expected.

Responsibilities

• Develop new and improve existing manufacturing processes focusing on affordability.
• Create and manage project plans for process development activities.
• Provide ROI justification for process improvements and prepare equipment for production.

Skills

Process engineering

Multi-layered boards

DOE/SPC/6 sigma

GD&T

MS Office

US citizenship

Education

B.S. in Engineering or related STEM

Tools

CATIA

SolidWorks

Job description

Northrop Grumman Mission Systems is seeking a Manufacturing Engineer for the Advanced Interconnects and Multilayer Solutions (AIMS) cell in Maryland. The role provides manufacturing technical leadership to fabricate printed wiring boards, manifolds, and backplanes for next-generation RF hardware, focusing on drilling/routing processes.

The position requires strong communication, fast-paced teamwork, and the ability to influence design for manufacturability across cross-functional teams.