Manufacturing Process Engineer – RF PCB & Interconnects

Northrop Grumman; Baltimore (MD); On-site; USD 80,000 - 119,000; Full time

Benefits offered by this job

Health insurance

Life insurance

Disability insurance

Savings plan

Paid holidays

PTO

Job summary

Northrop Grumman Mission Systems is seeking a Manufacturing Process Engineer for the Advanced Interconnects and Multilayer Solutions (AIMS) cell. You will develop and optimize manufacturing processes for printed wiring boards, manifolds, and backplanes, manage processing parameters, and support design producibility Reviews.

The role requires strong communication, multi-tasking in a fast-paced environment, and the ability to obtain a US Secret Security Clearance.

Qualifications

• Bachelor of Science degree in Engineering or related STEM area with a minimum of 2 years of relevant experience (or with a minimum of 1 year with an MS).
• Process Engineering experience; DOE/SPC/6 sigma concepts; GD&T; MS Office; US Secret Clearance/US Citizenship may be required.

Responsibilities

• Developing new and maintaining or improving existing manufacturing processes with a focus on affordability.
• Creating and managing project plans for process development activities.
• Providing ROI justification for process improvements.
• Specifying, identifying and procuring new manufacturing equipment for production readiness.

Skills

Process Engineering

DOE

SPC

GD&T

MS Office

Education

BS in Engineering

Tools

TrueChem

PowerBI

Tableau

VBA

Job description

Northrop Grumman Mission Systems is seeking a Manufacturing Process Engineer for the Advanced Interconnects and Multilayer Solutions (AIMS) cell. You will develop and optimize manufacturing processes for printed wiring boards, manifolds, and backplanes, manage processing parameters, and support design producibility Reviews.

The role requires strong communication, multi-tasking in a fast-paced environment, and the ability to obtain a US Secret Security Clearance.